Abstract:Electronic devices are progressively fabricated on flexible substrates allowing new fields of applications. A maskless and very flexible structuring process is offered by ablation using ultra-short pulse laser irradiation. Usually, certain areas of a functional thin film coating are locally removed to yield the needed device structures. Micro laser patterning quality is not only influenced by the beam properties (beam profile, fluence) but also by pulse overlap, scan repetitions and many other factors such as substrate and coating material. This makes process parameter optimization a challenging task. In this paper, we present a systematic approach to efficiently find suitable parameters for laser-induced ablation of thin films on susceptible polymer substrates. As an example, we use a sputtered NiCr coating with a thickness of 100 $nm$ on a polyimide film made by spin coating of PI-2611 precursor (@ 2000 $rpm$ > ca. 8 ${\mu}m$, HD microsystems). Irradiation is conducted using a fs-laser with infrared wavelength of 1030 $nm$ and a pulse length of 212 $fs$. The energy per pulse is varied in the range of 0,29 ${\mu}J$ to 4,83 ${\mu}J$, yielding fluence values between 70 $mJ/cm^2$ and 1,11 $J/cm^2$. Ablation threshold fluence for a 100 $nm$ layer of NiCr was found to be ${\phi}_{th}$ ($N_P$:1)=0,50 $J/cm^2$ and the incubation factor was evaluated to be ${\xi}$=0,53. A clear distinction must be made between the material ablation at the surface of a bulk material and the selective removal of a thin film. In the second case effects such as flaking occur in practice and influence the ablation characteristic. We then investigate different varieties of thin film removal including dot-, line- and areal-ablation. The methodology is presented using a practical example, but can be applied to selective ablation of a wide range of thin film systems.

Comparison of Femtosecond Laser-Induced Front- and Rear-Side Ablation of Films

Effect of film properties on the material removing characteristics in femtosecond laser rear-side ablation of chromium film

Damage mechanism and morphology characteristics of chromium film in femtosecond laser rear-side ablation

Micro-ablation at the front and rear surfaces of a fused silica window by using a femtosecond laser pulse in air

Rear-side Picosecond Laser Ablation of Indium Tin Oxide Micro-Grooves

Femtosecond laser ablation on gold-chromium film

Effect of laser fluence on sacrificial layer morphology in laser rear-side ablation of film

Methodology of selective metallic thin film ablation from susceptible polymer substrate using pulsed femtosecond laser

Study of Femtosecond Laser Ablation Effect on Micro-Processing for 4H-SiC Substrate

Study of Femtosecond Ablation on Aluminum Film with 3D Two-Temperature Model and Experimental Verifications

Picosecond laser ablation of high-quality micro-grooves on CIGS (CuIn(1-x)Ga2Sex) thin films

An Atomic-Level Study of Material Ablation and Spallation in Ultrafast Laser Processing of Gold Films

Ablation characteristics of femtosecond laser on wide band-gap ceramics

Interaction Mechanism of Femtosecond Laser and Wide Band-Gap Material

Comparative experimental study of laser-induced transitions in crystalline silicon by femtosecond, picosecond, and millisecond laser ablation

Transient ablation topography of a thin chromium film after ultrashort pulsed laser irradiation in the spallation and phase explosion regime

Influence of surface morphology on processing of C/SiC composites via femtosecond laser

Processing Microstructure on Film by Femtosecond Laser

High-precision fabrication of Pd film by laser rear-side ablation with thick sacrificial layer

Continuous GHz femtosecond laser interacting with aluminum film: Simulation and experiment

Experimental probe into the femtosecond laser ablation thresholds in carbon fiber reinforced polymer and assessment of the measurement theories