Abstract:The thermal property of diamond/metal composites mainly depends on the chemical bonding and structure of interfacial layers between two heterogeneous materials. To improve the thermal property of the diamond/metal composites, a metallic carbide layer that bridging both crystal structure and thermal transport of heterogeneous interfaces is required, though the formation mechanism of such carbide interfaces during powder sintering remains under debate, particularly for the scenario of varying thermal diffusion. Here, systematic experiments of diamond/Cu–Cr composites have been conducted to unravel the effects of two important variables for thermal diffusion, temperature (800–1025 °C) and holding time (5–60 min), on the growth of chromium carbide interfaces and the resulting thermal conductivity. It is found that the main characteristics of chromium carbide layer is more related to the holding time, that is, prolonged thermal diffusion. The extraction of diamonds in as-sintered composites allows a detailed quantification of coating efficiency and crystallographic-facet-dependence of chromium carbide interfaces during diamond/metal reaction at varying temperature and holding times. It is found that the prolonged thermal diffusion is not as expected to deteriorate the thermal conductivity, and leads to a more densified structure with highest thermal conductivity instead (∼577 W/(m·K)). Furthermore, thermal diffusion of diamond/metal reaction is discussed based on theoretical models. We theoretically demonstrate that long thermal diffusion could enhance the thermal diffusivity for the composites and achieve ∼90.8% of theoretical thermal conductivity predicted by the Maxwell-Eucken model.

Thermal Conductivity of the Diamond-Cu Composites with Chromium Addition

High thermal conductivity Cu-3Cr/Diamond composites fabricated by powder metallurgy

Quantitative control of interfacial structure and thermal conductivity between diamond and copper via thermal diffusion of alloying element

RETRACTED: Cr-Diamond/Cu Composites with High Thermal Conductivity Fabricated by Vacuum Hot Pressing

Research on thermal conductivity of diamond with Cr, Ti coating/copper composite materials by sintering under high pressure

Interfacial Characterization and Thermal Conductivity of Diamond/Cu Composites Prepared by Liquid-Solid Separation Technique

Preparation and Characterization of Diamond/Cu Composites

Progress in the Copper-Based Diamond Composites for Thermal Conductivity Applications

A numerical study of the effect of interfacial thermal resistance on thermal conductivity of Cu-B/diamond composites

Effects of different element coatings on the interface characteristics and thermal conductivity of vacuum-sintered diamond/Cu composites

Critical effect and enhanced thermal conductivity of Cu-diamond composites reinforced with various diamond prepared by composite electroplating

Microstructure of Cu-diamond Composites with Near-Perfect Interfaces Prepared Via Electroplating and Its Thermal Properties

Preparation and thermal conductivity of C/C composites filled with diamond particles

Recent advances in the studies of diamond/aluminum and diamond/copper composites with high thermal conductivity

High thermal conductivity of diamond/copper composites produced with Cu–ZrC double-layer coated diamond particles

Effects of Diamond Content on the Thermal Conductivity of Copper Matrix Composite Materials Prepared by Cold Spraying

Enhanced Thermal Conductivity of Diamond/copper Composite Fabricated Through Doping with Rare-Earth Oxide Sc2O3

High thermal conductivity through interfacial layer optimization in diamond particles dispersed Zr-alloyed Cu matrix composites

Study of the Hot-Pressing Sintering Process of Diamond/Copper Composites and Their Thermal Conductivity

Synergetic effect enabling high thermal conductivity in Cu/diamond composite

Microstructure and Thermal Behavior of Diamond/cu Composites: Effects of Surface Modification