Abstract:Magnetorheological finishing is limited by weak polishing forces and small polishing areas, resulting in a low polishing efficiency. This study formulates a method for dynamic magnetic field magnetorheological finishing in compression-shear mode with a constant load and variable gap, which can remodel the magnetic particle string using a dynamic magnetic field and enhance the polishing force by a constant load and variable gap. To investigate the impact of process parameters on macro and micro machining processes, as well as their effects, a series of experiments were conducted to investigate the polishing force, machining clearance, and machining effect of single-crystal silicon wafers under four different conditions: static magnetic field magnetorheological finishing (T 1 ), dynamic magnetic field magnetorheological finishing (T 2 ) at a constant gap, static magnetic field magnetorheological finishing (T 3 ), and dynamic magnetic field magnetorheological finishing (T 4 ) with a constant load and variable gap. The results indicated that the shearing force and processing quality significantly improved in the constant-load and variable-gap modes, and the process of machining clearance reduction involved two stages: fast and slow compression. The shearing force of T 3 increased by 35 % compared to T 1 , and T 4 increased by 20 % compared to T 2 . The material removal rate of T 3 and T 4 increased over time, in contrast to those of T 1 and T 2 . The key parameters of the T 4 single-factor shear and machining gap testing experiments show that the constant load variable gap compression process adaptively adjusts the machining gap such that the chain string structure is in a body-centered cubic structure (BCT), increasing the number of abrasive contacts and the depth of pressure into the workpiece to achieve a significant increase in the polishing shear constant load.

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