Abstract:A thermal wind sensor utilizes the fact that airflow over a heated plate will cool it asymmetrically, with the upstream part of the plate being cooled more than the downstream part. In the temperature-balanced (TB) mode, the heating power may be distributed spatially in the sensor such that any flow-induced temperature gradient is cancelled. Information about the airflow can be extracted in the distribution of heating power in the sensor. Ideally, the influence of changes in the ambient temperature on the sensor’s output can be eliminated if in the whole measurement range the temperature sensor sensitivities are equal. However, because of the temperature dependency of the material properties of the airflow and the sensor, it may have a temperature drift. This paper, for the first time, investigates temperature effects of the ceramic microelectromechanical system (MEMS) thermal wind sensor based on the TB mode. The sensor consists of four outlying heaters and four inlying thermistors in two orthogonal directions on a ceramic substrate. When working in the TB mode, it could measure wind speed and wind direction by applying a power difference on the upstream and downstream heaters, so that the flow-induced temperature gradient is eliminated. Theoretical analysis has been developed which takes the variations of thermophysical properties in the sensor and the control circuits into account. Experiments for testing wind speed and direction have been performed in a wind tunnel with an adjustable ambient temperature. It shows that the wind speed is linearly influenced by the ambient temperature while the wind direction is inherently unaffected by ambient temperature variations. After compensation, the sensor shows a credible performance with an error of less than ±1m/s in wind speed and ±2° in wind direction in a temperature range from 0 °C to 30 °C.

Thermal asymmetry compensation of a wind sensor fabricated on ceramic substrate

Flip-Chip on Board Packaging of A Thermal Wind Sensor

A FCOB packaged thermal wind sensor with compensation

Effect of Packaging Asymmetry on the Performance of A 2d Mems Thermal Wind Sensor with Different Heating Geometries

Ceramic Film Packaging for 2-D Thermal Wind Sensor Using LTCC Technology

Low-Drift MEMS Thermal Wind Sensor With Symmetric Packaging Using Plastic Injection Molding Process

Temperature Effects of a Ceramic MEMS Thermal Wind Sensor Based on a Temperature-Balanced Mode

Novel Temperature Drift Compensation for MEMS Thermal Wind Sensors by Heating Power Calibration Circuits

Thermal wind sensor fabricated on low thermal conduction substrate

Annular-Encapsulation Packaging To Realize High-Performance Mems Thermal Wind Sensor

Experiments and Solution of Asymmetry Effect for Mems Thermal Wind Sensor

Ceramic Thermal Wind Sensor Based on Advanced Direct Chip Attaching Package

Development of A Self-Packaged 2d Mems Thermal Wind Sensor for Low Power Applications

Sensitivity Improvement of a 2D MEMS Thermal Wind Sensor for Low-Power Applications

A Hot Film Wind Sensor with Four Constant Temperature Difference Elements Fabricated on Ceramic Substrate

A Self-Packaged Two-Dimensional Thermal Wind Sensor Based on Thermopiles for Low Cost Applications

Experiment Of The Mems Wind Sensor Based On Temperature-Balanced Mode

A Self-Packaged Self-Heated Thermal Wind Sensor with High Reliability and Low Power Consumption

Modelling and Characterization of a Robust, Low-Power and Wide-Range Thermal Wind Sensor

COMPACT MEMS THERMAL WIND SENSOR USING DUAL POLYSILICON LAYERS WITH IMPROVED ACCURACY

CMOS thermal wind sensor and its package