Thermal wind sensor fabricated on low thermal conduction substrate

Shen Guangping,Qin Ming,Zhang Hua,Wu Jian
DOI: https://doi.org/10.3321/j.issn:0254-3087.2009.05.017
2009-01-01
Abstract:In order to improve the sensitivity of thermal anemometer,this paper proposes a method for fabricating the sensor on low heat conductivity substrate.Verification was carried out by using finite element method simulation,as well as the experimental results.The circular structure sensor measures the 2-D wind speed and direction using calorimetric principle.In order to verify the influence of substrate thermal conduction on sensor sensitivity,two sensors were fabricated on glass and ceramic substrates respectively using MEMS lift-off p1rocess.Wind tunnel test shows that both sensors can detect 360° wind direction and wind speed range over 10 m/s.Besides,through comparison of the two groups of test results,it can be found that the glass substrate wind sensor shows higher sensitivity than the ceramic substrate one,which is fully consistent with the FEM simulation results.
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