Abstract:A thermal wind sensor utilizes the fact that airflow over a heated plate will cool it asymmetrically, with the upstream part of the plate being cooled more than the downstream part. In the temperature-balanced (TB) mode, the heating power may be distributed spatially in the sensor such that any flow-induced temperature gradient is cancelled. Information about the airflow can be extracted in the distribution of heating power in the sensor. Ideally, the influence of changes in the ambient temperature on the sensor’s output can be eliminated if in the whole measurement range the temperature sensor sensitivities are equal. However, because of the temperature dependency of the material properties of the airflow and the sensor, it may have a temperature drift. This paper, for the first time, investigates temperature effects of the ceramic microelectromechanical system (MEMS) thermal wind sensor based on the TB mode. The sensor consists of four outlying heaters and four inlying thermistors in two orthogonal directions on a ceramic substrate. When working in the TB mode, it could measure wind speed and wind direction by applying a power difference on the upstream and downstream heaters, so that the flow-induced temperature gradient is eliminated. Theoretical analysis has been developed which takes the variations of thermophysical properties in the sensor and the control circuits into account. Experiments for testing wind speed and direction have been performed in a wind tunnel with an adjustable ambient temperature. It shows that the wind speed is linearly influenced by the ambient temperature while the wind direction is inherently unaffected by ambient temperature variations. After compensation, the sensor shows a credible performance with an error of less than ±1m/s in wind speed and ±2° in wind direction in a temperature range from 0 °C to 30 °C.

Effect of Packaging Asymmetry on the Performance of A 2d Mems Thermal Wind Sensor with Different Heating Geometries

Experiments and Solution of Asymmetry Effect for Mems Thermal Wind Sensor

Annular-Encapsulation Packaging To Realize High-Performance Mems Thermal Wind Sensor

Development of A Self-Packaged 2d Mems Thermal Wind Sensor for Low Power Applications

Thermal stress of MOEMS Accelerometers Based on Grating Interferometric cavity

Thermal asymmetry compensation of a wind sensor fabricated on ceramic substrate

Low-Drift MEMS Thermal Wind Sensor With Symmetric Packaging Using Plastic Injection Molding Process

Ceramic Film Packaging for 2-D Thermal Wind Sensor Using LTCC Technology

Temperature Effects of a Ceramic MEMS Thermal Wind Sensor Based on a Temperature-Balanced Mode

Flip-Chip on Board Packaging of A Thermal Wind Sensor

Sensitivity Improvement of a 2D MEMS Thermal Wind Sensor for Low-Power Applications

Design of a 2D Thermal Wind Sensor Based on MEMS Process

Temperature Effects on the Wind Direction Measurement of 2D Solid Thermal Wind Sensors

Investigation of Housing on Packaged MEMS Wind Sensors for Industrial Application

Analysis and Compensation of Benchmark Drift of Micromachined Thermal Wind Sensor Caused by Packaging Asymmetry

Influence of Aerodynamic Housing on the Performance of MEMS Wind Sensor

Linearity and Sensitivity Analysis of MEMS Thermal Wind Sensor via Analytical Model

Modelling and Characterization of a Robust, Low-Power and Wide-Range Thermal Wind Sensor

COMPACT MEMS THERMAL WIND SENSOR USING DUAL POLYSILICON LAYERS WITH IMPROVED ACCURACY

Octagon-Shaped 2-D Micromachined Thermal Wind Sensor for High-Accurate Applications

A Self-Packaged Self-Heated Thermal Wind Sensor with High Reliability and Low Power Consumption