The Study of the Relationship Between the Slenderness Ratio of Fillers and the Percolation Threshold

XIA Yan-ping,TAO Yu,ZHANG Guo-qing,WU Xi-jun,SU Hao,LIANG Ping-hui,WU Hai-ping,TAO Guo-liang
2010-01-01
Journal of Functional Biomaterials
Abstract:Nanostructured silver with different slenderness ratio was prepared by a microwave(MW) assisted method.The nano-silver were characterized by scanning electron microscope(SEM) and X-ray diffraction(XRD).Thermal conductive adhesive(TCA) were prepared by using the different slenderness ratio nano-silver as the thermal conductive filler.The thermal conductivity of the adhesive was measured.The result indicated that the slenderness ratio of the nano-silver had important influence on it's percolation threshold.Three kinds of percolation threshold theory were used to simulate the experiment results.The simulation results obtained by using modified Nielsen-lewis model were good agree with the experimental results.
What problem does this paper attempt to address?