Research status of thermal conductivity in copper-carbon composite materials
Hong-xu Chang,Liang Bai,Li-wei Sun,Dan-yang Wang,Jing-shun Liu,Ze Li
DOI: https://doi.org/10.1177/08927057241298211
IF: 3.0272
2024-11-08
Journal of Thermoplastic Composite Materials
Abstract:Journal of Thermoplastic Composite Materials, Ahead of Print. With the advent of the 5G era, thermal management materials for electronic packaging are evolving towards high thermal conductivity, good thermal expansion matching, low density, and integrated functional structures. Copper-carbon composite materials, leveraging the advantages of copper such as high strength, hardness, electrical and thermal conductivity, as well as the excellent mechanical, electrical, and thermal properties of carbon materials, have become one of the focal points in thermal management material research. This article provides an overview of the research progress on copper-carbon composite materials, highlighting the characteristics of different carbon materials (Diamond, Carbon nanotubes, Graphene, Graphite flakes, Graphite films, Carbon fibers) in combination with copper, as well as the preparation methods for copper-carbon composites. At present, the thermal conductivity can be increased to more than 600 W/(m·K), and the preparation method is hot pressing sintering. It discusses the main issues and control methods encountered in the preparation and application of copper-carbon composites and presents prospects for the future development of these materials, offering references for the research and preparation of copper-carbon composites.
materials science, composites