Abstract:An electromechanically-coupled micro-contact resistance measurement system is built to mimic the contact process during fatigue testing of nanoscale-thickness interconnects using multiple probe methods. The design combines an optical microscope, high-resolution electronic balance, and micromanipulator-controlled electric probe, and is coupled with electrical measurements to investigate microscale contact physics. Experimental measurements are performed to characterize the contact resistance response of the gold nanocrystalline pad of a 35-nm-thick interconnect under mechanical force applied by a tungsten electrode probe. Location of a stable region for the contact resistance and the critical contact force provides better understanding of micro-contact behavior relative to the effects of the contact force and the nature of the contact surface. Increasing contact temperature leads to reduced contact resistance, softens the pad material, and modifies the contact surface. The stability of both contact resistance and interconnect resistance is studied under increasing contact force. Major fluctuations emerge when the contact force is less than the critical contact force, which shows that temporal contact resistance will affect interconnect resistance measurement accuracy, even when using the four-wire method. This performance is demonstrated experimentally by heating the Au line locally with a laser beam. Finally, the contact resistances are calculated using the LET (Li–Etsion–Talke) model together with combined Holm and Sharvin theory under various contact forces. Good agreement between the results is obtained. This research provides a way to measure change in interconnect line resistance directly under a stable contact resistance regime with a two-wire method that will greatly reduce the experimental costs.

Measuring the thermal contact resistance of a junction by T type probe method

Experimental Investigation of the Thermal Impedance of Interstitial Material at A Junction

A novel method for simultaneous measurements of the intrinsic thermal conductivity and thermal diffusivity of individual fibers

Measurement Methods and Applications for Thermophysical Properties at Micro/Nanoscales

New Method for Interfacial Evaluation of Carbon Fiber/Thermosetting Composites by Wetting and Electrical Resistance Measurements

Thermal Characterization of Microscale Conductive and Nonconductive Wires Using Transient Electrothermal Technique

Characterization of Micro-Contact Resistance Between A Gold Nanocrystalline Line and A Tungsten Electrode Probe in Interconnect Fatigue Testing

Theoretical and experimental study of the thermal contact resistance at the junction of crossed cylinders

Experimental Study on Nanosized Contact Point

Measurement of the intrinsic thermal conductivity of a multiwalled carbon nanotube and its contact thermal resistance with the substrate

Measurement of Thermal Contact Resistance Between Individual Carbon Fibers Using a Laser-Flash Raman Mapping Method

A three-probe method for accurate nanoscale thermal transport measurements

Experimental characterization methods for thermal contact resistance: A review

A Steady-State Short-Hot-Wire Method For Measurement Of Thermal Conductivity Of A Single Carbon Fiber

Numerical study of thermal contact resistance considering spots and gap conduction effects

Measurements of Thermal Conductivity and Electrical Conductivity of a Single Carbon Fiber

Simultaneous Measurements of Thermal Properties of Individual Carbon Fibers

An improved steady-state method for measuring the thermal contact resistance and bulk thermal conductivity of thin-walled materials having a sub-millimeter thickness

Experimental Investigation of High Temperature Thermal Contact Resistance with Interface Material

A Two-Sensor 3Ω-2Ω Method for Thermal Boundary Resistance Measurement

Simultaneous Measurement of Thermal Conductivity and Thermal Contact Resistance of Individual Carbon Fibers Using Raman Spectroscopy