End-Bonded Contacts of Tellurium Transistors
Wei Jiang,Xudong Wang,Yan Chen,Shuaiqin Wu,Binmin Wu,Xin Yang,Tie Lin,Hong Shen,Xiangjian Meng,Xing Wu,Junhao Chu,Jianlu Wang
DOI: https://doi.org/10.1021/acsami.0c21675
2021-02-05
Abstract:The development of novel low-dimensional materials makes the metallic contact to nanostructure facing challenges. Compared to side contacts, end-bonded contacts are proposed to be more effective pathways for charge injection and extraction. However, there is a lack of up-to-date understanding regarding end-bonded contacts, especially the recently emerged high-performance field-effect transistors (FETs). Here, the end-bonded contacts in tellurium (Te) transistors are first achieved by inducing metal semiconductor alloy. The formation of Pd–Te alloy structure is confirmed by a high-resolution transmission electron microscope (HRTEM) in Te-nanorod-based FETs. The ultralow specific contact resistance is estimated to be 5.1 × 10<sup>–9</sup> Ω cm<sup>2</sup> by the transmission line mode. On the basis of this finding, Te FETs are shown to exhibit incredible electronic properties, metal-insulator transition, and photodetection performance. This in-depth investigation of the end-bonded contact between Pd and Te speeds up the potential application of Te nanostructure and provides a feasible method for contact engineering in advanced devices.The Supporting Information is available free of charge at <a class="ext-link" href="/doi/10.1021/acsami.0c21675?goto=supporting-info">https://pubs.acs.org/doi/10.1021/acsami.0c21675</a>.Additional characterization data including experimental details, electrical measurements, photodetection performance, TEM, EDS mappings, and calculated resistances (<a class="ext-link" href="/doi/suppl/10.1021/acsami.0c21675/suppl_file/am0c21675_si_001.pdf">PDF</a>)This article has not yet been cited by other publications.
materials science, multidisciplinary,nanoscience & nanotechnology