Abstract:Classical molecular dynamics simulations of metallic systems have been extensively applied in recent years for the exploration of the energetic behavior of mesoscale structures and for the generation of thermodynamic and physical properties. The evaluation of the conditions leading to the melting of pure metals and alloys is particularly challenging as it involves at one point the simultaneous presence of both a solid and a liquid phase. Defects such as vacancies, dislocation, grain boundaries and pores typically promote the melting of a solid by locally increasing its free energy which favors the destruction of long-range ordering at the origin of this phase transition. In real materials, many of these defects are microscopic and cannot yet be modelled via conventional atomistic simulations. Still, molecular dynamics-based methodologies are commonly used to estimate the melting temperature of solids. These methods involve the use of mesoscale supercells with various nanoscale defects. Moreover, the deterministic nature of classical MD simulations requires the adequate selection of the initial configuration to be melted. In this context, the main objective of this paper is to quantify the precision of the existing classical molecular dynamics computational methods used to evaluate the melting point of pure compounds as well as the solidus/liquidus lines of Al-based binary metallic systems. We also aim to improve the methodology of different approaches such as the void method, the interface method as well as the grain method to obtain a precise evaluation of the melting behavior of pure metals and alloys. We carefully analyzed the importance of the local chemical ordering on the melting behavior. The ins and outs of different numerical methods in predicting the melting temperature via MD are discussed through several examples related to pure metallic elements, congruently and non-congruently melting compounds as well as binary solid solutions. It is shown that the defect distribution of the initial supercell configuration plays an important role upon the description of the melting mechanism of solids leading to a poor predictive capability of melting temperature if not properly controlled. A new methodology based on defect distribution within the initial configuration is proposed to overcome these limitations.

The effects of defects on melting of copper

The Effects of Defects on Copper Melting under Hydrostatic and Shock Loading

Advanced Numerical Characterization of Mono-Crystalline Copper with Defects

Atomistic Numerical Investigation of Single-crystal Copper Nanowire with Surface Defects

Atomistic Exploration of Deformation Properties of Copper Nanowires with Pre-Existing Defects

Melting of Defective Cu with Stacking Faults

MD Investigations for Mechanical Properties of Copper Nanowires with and Without Surface Defects

Numerical Exploration Of The Defect'S Effect On Mechanical Properties Of Nanowires Under Torsion

Melting of Cu under Hydrostatic and Shock Wave Loading to High Pressures

Influence of Defects During the Tensile Deformation of Cu–Al Joint Interfaces at the Nano Scale

Shock-induced spall in copper: The effects of anisotropy, temperature, defects and loading pulse

An investigation of the combined size and rate effects on the mechanical responses of FCC metals

Atomistic simulation of thermal effects and defect structures during nanomachining of copper

Dislocation evolution and peak spall strengths in single crystal and nanocrystalline Cu

Effects of Orientation and Vacancy Defects on the Shock Hugoniot Behavior and Spallation of Single-Crystal Copper

Effects of Flow Defects on Hypothetical ZrCu Metallic Glasses Microstructure and Plasticity: A Molecular Dynamics Analysis

Molecular Insight into the Deformation of Single Crystal Copper Loaded by High-Speed Shock Wave

On the exploration of the melting behavior of metallic compounds and solid solutions via multiple classical molecular dynamics approaches: application to Al-based systems

Molecular Dynamics Simulations of the Preparation and Deformation of Nanocrystalline Copper

Molecular Dynamics Simulation and Analysis of Bulk and Surface Melting Processes for Metal Cu

Effects of void shape and location on the fracture and plastic deformation of Cu (crystalline) /Cu 64 Zr 36 (amorphous) composites