Shock-induced spall in copper: The effects of anisotropy, temperature, defects and loading pulse

Shengnian Luo,Timothy C. Germann,Qi AN,LiBo Han
DOI: https://doi.org/10.1063/1.3294971
2009-01-01
AIP Conference Proceedings
Abstract:Shock-induced spall in Cu is investigated with molecular dynamics simulations. We examine spallation in initially perfect crystals and defective solids with grain boundaries (columnar bicrystals), stacking faults or vacancies, as well as the effect of temperature and loading pulses. Spall in single crystal Cu is anisotropic, and defects and high temperature may reduce the spall strength. Taylor-wave (triangular or decaying-shock) loading is explored in comparison with square wave shock loading.
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