Abstract:The aim of this work is to carry out molecular dynamics simulation of the uniaxial stretching of a cooled Al/Cu composition. The LAMMPS software package has been used for calculations, which includes the classic molecular dynamics code with an emphasis on modeling materials. The Ovito program has been used for visualization, which has a large number of functions, so that the user can thoroughly investigate the results obtained. When describing the interatomic interaction in the Al/Cu nanocomposite, we used the potential of the embedded EAM atom. The choice of potential is due to the fact that it adequately describes and reproduces the properties of a wide class of materials, including metals, semiconductors and alloys. The simulation has been carried out in two stages. At the first stage, a sample consisting of two crystallites of aluminum and copper in the form of parallelepipeds, connected along one of the joint boundaries, was placed in the computational domain and cooled at constant pressure. Cooling was carried out to stabilize the nanosystem. At the second stage, corresponding to the deformation, the temperature and pressure were changed in accordance with the ongoing physical processes. The algorithm of the thermostat and the Nose – Hoover barostat has been used to control the temperature and pressure at the initial stage of cooling. The paper demonstrates the nature of the distribution of longitudinal stresses over the entire volume of the crystal in the process of stretching. When the sample reached the elastic limit, the nucleation of crystal lattice defects and their distribution over the crystal in the form of shifts and rotations of atoms in crystal planes were observed. Areas of plastic deformation origin have been determined. The maximum destruction of the material occurred along the interface. The parameters of the Al/Cu composition (deformation, temperature, mechanical stress) have been dynamically investigated using molecular dynamics simulation. Comparison of the characteristics of the sample in the deformation process has been carried. Under loading conditions, a variety of processes are implemented in the material, including generation of defects, elastic and plastic deformation, generation of damage, and mechanical mixing.

Molecular Dynamics Simulations of the Preparation and Deformation of Nanocrystalline Copper

Advanced Numerical Characterization of Mono-Crystalline Copper with Defects

Atomistic Numerical Investigation of Single-crystal Copper Nanowire with Surface Defects

Atomistic Exploration of Deformation Properties of Copper Nanowires with Pre-Existing Defects

Simulating Size and Volume Fraction-Dependent Strength and Ductility of Nanotwinned Composite Copper

Improving thermal stability and Hall-Petch breakdown relationship in nanocrystalline Cu: A molecular dynamics simulation study

Molecular Dynamics Simulations of Tension–compression Asymmetry in Nanocrystalline Copper

Molecular dynamics simulation on elastoplastic properties of the void expansion in nanocrystalline copper

Modeling of Deformation and Destruction Processes of Al/Cu Nanocomposites

Molecular Dynamics Simulations of Tensile Deformation of Gradient Nano-Grained Copper Film

Atomic-scale modeling of the deformation of nanocrystalline metals

Deformation of Nanoporous Copper Subjected to High-Rate Compression at Various Temperatures

Studying the elastic properties of nanocrystalline copper using a model of randomly packed uniform grains

Study of the effects of grain size on the mechanical properties of nanocrystalline copper using molecular dynamics simulation with initial realistic samples

Multiaxial Behavior of Nanoporous Single Crystal Copper: a Molecular Dynamics Study

Size-dependent deformation mechanisms in copper gradient nano-grained structure: A molecular dynamics simulation

An investigation of the combined size and rate effects on the mechanical responses of FCC metals

NUMERICAL SIMULATION FOR DEFORMATION OF NANO-GRAINED METALS

Grain Coarsening in Nanocrystalline Copper with Very Small Grain Size During Tensile Deformation

Molecular Dynamics Study on the Nano-Void Growth in Face-Centered Cubic Single Crystal Copper

Molecular Insight into the Deformation of Single Crystal Copper Loaded by High-Speed Shock Wave