Growth Of Copper-Indium Nanorods On Si Substrate Using Porous Anodic Alumina As Template

WenHua Zhang,H. Lam,Jie Li,Man Wang,Shiping Jiang,Charles C. Surya,FeiYun Zhu
DOI: https://doi.org/10.1088/1742-6596/188/1/012028
2009-01-01
Abstract:Copper-indium nanorod arrays have been synthesized by electrodeposition using porous anodic alumina nano template supported on a silicon substrate. Porous anodic alumina template was fabricated by evaporating aluminium film onto silicon substrate and then anodizing the aluminium film in diluted phosphoric acid. The approach employs a plasma etching to penetrate the alumina pore barrier layer before electrodeposition, which enables direct electrical and chemical contact with the silicon substrate electrode. The resulting template and copper-indium nonorods obtained were characterized using scanning electron microscopy (SEM) and energy-dispersived X-ray spectroscopic analyzer (EDS), the pores of alumina are found to have dimensions of 150-250 nm pore diameters and 330-510 nm pore spacings, partial filling of the pores of the alumina template by Cu-In is achieved. The results of this work reveal that the alumina nano template is particularly well suited to the etching mask and template-assisted growth of nanostructures to be integrated into rigid substrate.
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