Design, package and test of ultra high-speed low power 4:1 multiplexer

He Zhou,Jun Feng,Xin Guan,Li Zhang,Wei Li.,Zhiqiang Guan
2009-01-01
Abstract:A 2.5 to 3.125 Gbit/s 4:1 multiplexer using CSM (chartered semiconductor manufacturing) 0.35 μ m complementary metal oxide semiconductor (CMOS) process is described. This multiplexer is not only designed for the application of SDH (synchronous digital hierarchy) STM (synchronous transfer mode)-16 system but also for IEEE 802.3ae 10GBASE-X. The tree-type structure is adopted. The core circuits are composed of latches, selectors and a frequency divider. The core part is totally realized by CMOS logic for it has no static power consumption. Output data rate is up to 3.5 Gbit/s. The core power consumption of the chip is about 25 mW at a supply voltage of 3.3 V. Small out-line package (SOP)-16 is adopted. A high-speed printed circuit board (PCB) which is used in the packaged chip test is designed and produced. Output data rate of the packaged chip is up to 2.3 Gbit/s.
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