Design and Realization of Multi-Channel and High-Bandwidth 2.5D Transmitter Integrated With Silicon Photonic MZM

Huimin He,Haiyun Xue,Yu Sun,Fengman Liu,Liqiang Cao

DOI: https://doi.org/10.1109/jlt.2022.3175518

IF: 4.7

2022-08-01

Journal of Lightwave Technology

Abstract:Recently, the interconnection bandwidth of the data center is rapidly increasing. To satisfy the requirement for the high-performance data center, a 4-channel 2.5D silicon photonic transmitter is proposed and the packaging structure could increase the high-density scalability of the architecture for 1.6T3.2T co-packaging optics (CPO) module. The electrical driver and silicon photonic Mach-Zehnder modulator (MZM) are mounted to the silicon interposer by the micro-bumps. Meanwhile, the silicon interposer is mounted to the low temperature co-fired ceramic by the solder balls. The 2.5D transmitter is assembled to the motherboard by the high-speed ball grid array (BGA) connector to make it convenient to be replaced. The electrical optimization is implemented to make the insertion loss of the whole passive link within 1.55 dB under 40 GHz, which ensures the transmitter with the socket transmit the clear simulated eye diagram at 64 Gbps PAM4 rate per channel. Moreover, the thermal evaluation is performed, which includes the heat- dissipation evaluation and the thermal-induced impact on the edge light coupling. Finally, the substrates in the 2.5D transmitter are fabricated and the transmitter is realized by the improved assembly method. By the verification of the measurement, the 2.5D transmitter we proposed could work at 64 Gbps PAM4 signal transmission rate per channel with the 6pJbit power consumption. Regardless of the bandwidth of the electronic integrated circuit (EIC)MZM and the BGA connector, based on the simulation electrical bandwidth, it is potential for realizing 100 Gbps PAM4 signal transmission.

engineering, electrical & electronic,optics,telecommunications

What problem does this paper attempt to address?

This paper attempts to address the problem of the rapidly increasing demand for data center inter - connection bandwidth, especially in order to meet the requirements of high - performance data centers. A design and implementation scheme of a 4 - channel 2.5D silicon - photonics transmitter is proposed in this paper. By optimizing the packaging structure, this transmitter improves high - density scalability and is suitable for 1.6T/3.2T co - packaged optical modules. The paper mainly focuses on the following aspects:

1. **High Bandwidth and Low Power Consumption**: A multi - channel, high - bandwidth 2.5D silicon - photonics transmitter is designed to achieve low - power data transmission. It is mentioned in the paper that this transmitter can operate at a 64 Gbps PAM4 signal transmission rate per channel with a power consumption of only 6 pJ/bit.

2. **Packaging Technology**: The 2.5D packaging technology is adopted. The electrical driver and the silicon - photonics Mach - Zender modulator (MZM) are mounted on the silicon interposer through micro - bumps, and the silicon interposer is mounted on the low - temperature co - fired ceramic (LTCC) through solder balls. In addition, the 2.5D transmitter is connected to the motherboard through a high - speed ball grid array (BGA) connector, which is convenient for replacement.

3. **Electrical Performance Optimization**: By optimizing the insertion loss of the entire passive link, the loss at 40 GHz is kept within - 1.55 dB, ensuring a clear analog eye diagram between the transmitter and the socket.

4. **Thermal Management**: A thermal evaluation is carried out, including heat dissipation evaluation and analysis of the influence of temperature - induced edge - light coupling. Through these evaluations, the reliability and performance of the transmitter in a high - temperature environment are ensured.

5. **Manufacturing and Verification**: The manufacturing of the 2.5D transmitter is realized and verified by an improved assembly method. The measurement results show that this transmitter can operate at a 64 Gbps PAM4 signal transmission rate per channel with a power consumption of only 6 pJ/bit.

In summary, this paper aims to solve the demand for inter - connection bandwidth in high - performance data centers by designing and implementing a multi - channel, high - bandwidth 2.5D silicon - photonics transmitter, while ensuring low power consumption, high reliability and good thermal management performance.