Measurement of 3-D Profile of MEMS Structure with Microscopic Interferometry

Wei SUN,Wen-wen LIU,Xin KANG,Xiao-yuan HE
DOI: https://doi.org/10.3969/j.issn.1000-1158.2009.04.002
2009-01-01
Abstract:As the important role of 3-D profile measurement in the field of MEMS structures and the high-resolution performance of microscopic interferometry in optical metrology, an investigation on the measurement of 3-D profile of MEMS structure using microscopic interferometry is described. Owing to its special performance of de-noising and processing fringes without carrier, wrapped phase is obtained by the technique of continuous wavelet transform (CWT). Based on the homography relationship between an inflexion point and an ambiguous point, the real phase values can be retrieved by directly identifying any inflexion point from an unwrapped phase map without the use of a carrier. Using the proposed technique, both static and dynamic profiles of a micro beam and warpage of a hand phone chip are determined. This has provided an effective tool for the measurement of 3-D profile of MEMS structure with higher accuracy and simple but rapid operation.
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