Analysis of the Nano-Deformation Fields of Micro-Crack in Silicon by High-Resolution Transmission Electron Microscopy

Q. Gu,C. W. Zhao,H. Q. Jing,Y. M. Xing
DOI: https://doi.org/10.1117/12.839015
2008-01-01
Abstract:A nanoscale experimental study of micro-crack in silicon was presented by using a combination of high-resolution transmission electron microscopy and geometric phase analysis. The results show that there is an amorphous phase content in the crack body. The width of the amorphous narrow band which exists within the crack body is 2nm approximately. The geometric phase analysis technology was applied to calculate the strain fields of the crack tip. The trend of the experiment strain value ahead of the crack tip is the same with the trend of the isotropic elastic theory strain value.
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