Novel Integrated Double Pmos SOI-LIGBT with Low Loss and High Short-Circuit Capability
Jie Wei,Jinlong Lu,Kaiwei Dai,Jialei Tan,Renkuan Liu,Pengchen Zhu,Hui Li,Bo Zhang,Xiaorong Luo
DOI: https://doi.org/10.1109/ted.2024.3454035
IF: 3.1
2024-01-01
IEEE Transactions on Electron Devices
Abstract:An ultralow loss lateral insulated gate bipolar transistor (LIGBT) with high short-circuit capability is proposed and investigated by simulations. The proposed LIGBT features integrated double pMOS at the cathode side of a conventional LIGBT (Con. LIGBT) (named as IDP LIGBT), wherein pMOS1 is the depletion mode and pMOS2 is the enhancement mode. The potential V-P/V(N )of cathode P+/N+ regions are self-adaptively modulated by the pMOS2 and pMOS1. In the on-state, the parasitic diode D 1 (p-well/cathode N+ region) of IDP LIGBT is turned on to enhance the conductivity modulation effect and then achieve a low on-state voltage drop (V-on). During the turning off period, the pMOS2 is turned on before the main gate of LIGBT turning off to extract holes from the p-well quickly and decrease the VP, which turns off D1 and makes less carriers needed to be extracted. Meanwhile, the pMOS1 channel is self-adaptively narrowed and depleted with the increasing V-AK, which elevates the V-N and then reduces the cathode electron injection efficiency. Therefore, the IDP LIGBT achieves an ultrafast switching speed and a low turnoff loss (E-off). In the short-circuit state with high V-AK, the pMOS1 is self-adaptively pinched off to reduce cathode electron injection efficiency and saturation current, so as to achieve a better short-circuit withstanding time (t(SC)). Compared with the MOS resistor (MR) LIGBT, the IDP LIGBT decreases the E-off/V(on )by 55%/13% at the same V-on/E(off )and improves the t(SC) by 56%.