Growth and Characterization of Boron Nitride/Diamond Heterostructures
Avani Patel,M. McCartney,Saurabh Vishwakarma,R. Nemanich,Jesse M. Brown,David J. Smith
DOI: https://doi.org/10.1017/S1431927622010662
IF: 4.0991
2022-07-22
Microscopy and Microanalysis
Abstract:Ultrawide-bandgap (UWBG) semiconductors are attracting much recent attention due to their potential applications in high-power and high-temperature devices. Boron Nitride (BN) is one such UWBG semiconductor that is becoming of particular interest. Cubic BN (c-BN) has a bandgap of 6.4 eV, a breakdown field greater than 15 MV/cm, and thermal conductivity of ~940 W/m.K [1], making it a strong candidate for high-power electronics. However, the synthesis of c-BN using epitaxial growth methods is difficult. Allotropes of BN crystallize in the sp 2 -bonded hexagonal (h-BN), rhombohedral (rBN), and turbostratic (t-BN) phases, and in the sp 3 -bonded cubic (c-BN) and wurtzite phases (w-BN) [2]. h-BN is the most stable phase among these polymorphs and usually grows preferentially over c-BN, thus hindering the adoption of c-BN in emerging device technologies. In this study, transmission electron microscopy (TEM) has been used to evaluate the growth of c-BN on polycrystalline (PC) and single-crystal diamond substrates, using the technique of electron cyclotron resonance plasma-enhanced chemical vapor deposition. Samples suitable for cross-sectional TEM observation were prepared by focused-ion beam (FIB) milling using a Thermo-Fisher Helios 5UX dual-beam instrument with initial thinning at 30 keV and further thinning at 5 keV and 2 keV. A Philips-FEI CM-200 FEG TEM operated at 200 kV and an image-corrected FEI Titan 80-300 operated at 300 kV were used for imaging.
Materials Science,Engineering,Physics