A Method to Study the Crack Healing Process of Glassformers

W. H. Wu,J. L. Zhang,H. W. Zhou,Y. N. Huang,L. Zhang,X. N. Ying
DOI: https://doi.org/10.1063/1.2803070
IF: 4
2008-01-01
Applied Physics Letters
Abstract:A mechanical spectroscopy method of quantitatively monitoring the healing of stress-induced microcracks in small glass samples is described. Whereas the cracks are generated catastrophically at some unpredictable interval below the glass temperature Tg the healing process proves to be highly reproducible and a characteristic temperature for the crack healing process, the temperature of maximum healing rate Tch coincides with Tg.
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