Abstract:Electromigration refers to the motion of atoms under the influence of an electric field. The electromigration effect most often is a result of momentum transfer from electrons, but it can be also caused by electrostatic force. The electromigration effect was discovered by Gerardin in 1861 [1]. The electromigration effect upon interfacial reactions and the resulted polarity phenomenon were first reported by Chen et al. [2,3], although electromigration effect upon the microstructures of a conduction line, such as void and whisker formation, had been intensively investigated much earlier. Understanding of electromigration effects upon interfacial reactions have become even more important nowadays because of thinner conduction lines, more interconnection joints, and higher electric current densities in the modern electronic products, such as products of 3D packaging. The interfacial reactions with and without passage of electric currents in the Sn-Ag/Ni/Sn-Ag, Sn-Ag/Ni/Cu/Ni/ Sn-Ag, Sn-Ag-Cu/Ni/Sn-Ag-Cu and Sn-Ag-Cu/Ni/Cu/Ni/Sn-Ag-Cu sandwich-type samples were examined at 150, 180 and 200oC. The main focus of this study is to understand the possible effects of Cu diffusion upon the Ni/Sn-Ag and Ni/Sn-Ag-Cu interfacial reactions. Two types of substrates were used, and they were 500mm-thick Ni foil and 500 mm-thick Cu foil plated with 50 mm-thick Ni. Two kinds of electricity-bias were conducted. One kind was with DC current and the other kind was with DC current but reversing the direction in the middle of the reaction time. Cu6Sn5 and Ni3Sn4 are observed in the couples with Sn-Ag-Cu solder. Electromigration effects are significant, but no Cu diffusion effects upon the solder/Ni reactions are observed. [1] H. B. Huntington in “Diffusion in solids: recent developments”, edited by A. S.Nowich and J. J. Burton, Academic Press, New York, pp. 303-352, (1975). [2] C.-M. Chen and S.-W. Chen, 1999, “Electric Current Effects Upon the Sn/Ag Interfacial Reactions”, Journal of Electronic Materials, Vol. 28(7), pp. 902-906. [3] S.-W. Chen, C.-M. Chen, and W.-C. Liu, 1998, "The Electric Current Effects Upon the Sn\Cu and Sn\Ni Interfacial Reactions", Journal of Electronic Materials, Vol. 27(11), pp. 1193-1198.

Effects Of Cu On The Electromigration Behavior Of Al Interconnect By Using First-Principles Method

First principles calculation of the effects of solute atom on electromigration resistance of Al interconnects

Comparison of the Time-Dependent Physical Processes in the Electromigration of Deep Submicron Copper and Aluminum Interconnects

First-principles Calculations of the Effects of Cu and Ag Additions on the Electromigration of Sn-based Solder

Al-clad Cu Bond Wires for Power Electronics Packaging: Microstructure Evolution, Mechanical Performance, and Molecular Dynamics Simulation of Diffusion Behaviors

Study of the effects of an adatom Sn on the Cu surface electromigration using a first principles method

Understanding the Impact of Surface Engineering, Structure, and Design on Electromigration Through Monte Carlo Simulation and In‐Situ SEM Studies

Effect of intermetallic on electromigration and atomic diffusion in Cu/SnAg 3.0Cu 0.5/Cu joints: Experimental and first-principles study

Reservoir Effect and the Role of Low Current Density Regions on Electromigration Lifetimes in Copper Interconnects

Characterization of electromigration-induced short-range stress development in Al(0.25 at. % Cu) conductor line

Electromigration in Cu–Cu joints: Measurement of activation energy and polarity effect

Electromigration Effects Upon Cu/Ni/Sn-Ag and Cu/Ni/Sn-Ag-Cu Interfacial Reactions

Electromigration enhanced growth kinetics of intermetallics at the Cu/Al interface

Investigation of electromigration in copper interconnection of ULSI

The inhibition mechanism of liquid metal embrittlement cracks in the Fe–Cu system by Al: atomistic simulations and calculations

First-principles calculations of Ag addition on the diffusion mechanisms of Cu-Fe alloys

Finite Element Analysis Of Electromigration Reliability In Copper Chip Interconnect

Effects of electromigration on interfacial reactions in cast Sn/Cu joints

Interaction Effect between Electromigration and Microstructure Evolution

Effect of atomic diffusion on interfacial heat transfer and tensile property of copper/aluminum composites

The Effect Of Cu Orientation On Fracture Location In Cu3sn-Cu Interface Structure Under Monotonic Loading Condition By Molecular Dynamics Simulation