Electromigration enhanced growth kinetics of intermetallics at the Cu/Al interface

Junqi Shao,Shenghua Deng,Hongjin Zhao,Lihao Lou,Baosen Shi,Lvzhou Chen,Liang Xu

DOI: https://doi.org/10.1016/j.intermet.2023.108110

IF: 4.075

2023-11-11

Intermetallics

Abstract:The growth kinetic behaviors of the Cu/Al system under current were investigated. The current was shown to significantly promote the growth of the intermetallic (IMC) layer. The growth rate constant of the Al 4 Cu 9 layer under current was approximately 3.26 times higher than that processed without current. Moreover, the current direction leads to a significant difference in the growth rate of the IMC layer, which was attributed to the electromigration effect. Based on the traditional thermal-activated theory and electromigration theory, an electromigration and thermal dual-activated growth kinetic model incorporating the contributions of Joule heat and the nonthermal effect was constructed. The growth kinetic behaviors of the Al 4 Cu 9 layer were investigated by applying this model. The calculated growth activation energies under different current densities were almost constant and close to 130 kJ/mol. The experimental data were applied to verify the model, and the results showed that the model was in good agreement with the experimental results.

materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering