Dynamic Response of a Board-Level Electronic Package under Drop Impact Load

张波,丁汉,盛鑫军
DOI: https://doi.org/10.3969/j.issn.1000-3835.2008.06.024
2008-01-01
Abstract:With increase in electronic package density,the reliability of a board-level package under drop impact load becomes a key issue.In order to understand deeply the dynamic response of the board-level package system under drop impact load,the board-level package with two opposed edges fixed and another two opposed edges free is simplified as a two-dimensional multiple degrees of freedom(MDOF) system.The effect of IC components on the system vibration is ignored.The impact accelerations of the board-level drop test in time domain and frequency domain are obtained by experimental method.It shows that the impact pulse has high impact energy when the natural frequency is less than 2000Hz.The beam function combination method is adopted to solve the modal functions with the natural frequencies less than 2000Hz.Based on the modal functions,the deflection response and the acceleration response of the board-level test package under JEDEC standard drop impact load(a sine pulse with a peak acceleration of 1500g and a duration time of 0.5ms) are solved by the mode function combination method.The maximum deflection response is about 2.2mm,and the maximum acceleration response at the center of the package is about 2000g.The theoretical results are validated by finite element results and experimental results.In addition,the result also shows that the first modal function is fundamental during the system vibration.
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