Optimizing Technology of Bulk Electronic Field for Lateral High-Voltage Devices

Bo Zhang,Jianbing Cheng,Shengdong Hu,Xiaorong Luo,Ming Qiao,Baoxing Duan,Zhaoji Li
DOI: https://doi.org/10.1109/edssc.2008.4760735
2008-01-01
Abstract:REBULF (reduced bulk field) and ENDIF (enhanced dielectric layer field) technologies are used in the design of lateral power devices to improve breakdown voltage. The two technologies have been shown to offer good performance in a variety of application domains, both in bulk silicon and SOI substrates. This paper aims to offer a compendious and timely review of the two technologies and some works of our lab on the application of the two technologies in bulk silicon and SOI devices.
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