Abstract:In recent years, the rapid development of industry makes the proportion of interconnect in chip increase rapidly. In order to ensure the stability and reliability of the circuit, accurate 3D modeling and high efficiency parasitic parameter extraction are needed for the chip interconnect. This paper has carried out the research on the extraction of capacitance parameters of the 3D finite element interconnection line. Starting from the principle of multi-conductor capacitance calculation, the problem is reduced to solving the Laplace equation for point boundary conditions. By using the finite element method (FEM), the solving process is analyzed and deduced. In addition, based on the high-efficiency parallel support software framework JAUMIN, this paper realizes the parallel calculation of the three-dimensional finite element capacitance parameter extraction, which greatly improves the calculation efficiency. Finally, the algorithm is applied to a representative interconnect structure. The calculation results are compared with the multi-physics commercial simulation software COMSOL. The results show that the potential distribution diagram is consistent.

On-chip Interconnect Inductance Extraction Using Fast Multipole Method

Fast multipole integral equation method for VLSI interconnect inductance calculation

Capacitance extraction of high-density 3D interconnects using finite element method

COMBING MULTILEVEL GREEN'S FUNCTION INTERPOLATION METHOD WITH VOLUME LOOP BASES FOR INDUCTANCE EXTRACTION PROBLEMS

Parasitic Inductance Modeling for On-chip Interconnects Based on IC Analysis on Inductive Effects

Capacitance Extraction of Three-Dimensional Interconnects Using Element-By-Element Finite Element Method (Ebe-Fem) and Preconditioned Conjugate Gradient (pcg) Technique

A Fast Inductance Extraction Engine

2-D Interconnect Inductance and Resistance Extraction Based on the Coupled Circuit Method

Capacitance extraction of on-chip circular stacked inductors

Parallel Electromagnetic Modeling for Connectors Based on Domain Decomposition Preconditioners

Fast algorithm for the parameter extraction of multilayered multiconductor interconnections. Finite difference-measured equation of invariance method

On-chip inductance modeling and RLC extraction of VLSI interconnects for circuit simulation

Calculating Magnetic Vector Potential in 3-D Electromagnetoquasistatic Field with Fast Multipole Method

An Efficient Method of Calculating Inductance Using Near-Field Data

A mixed boundary element method for extracting frequency-dependent inductances of 3D interconnects

A Mixed Surface Integral Formulation for Frequency-Dependent Inductance Calculation of 3D Interconnects

Finite-difference Time-Domain Macromodel for Simulation of Electromagnetic Interference at High-Speed Interconnects

Electrical performance simulation of inhomogeneous multilayer LTCC structure by hybrid method

Study on Extraction of Capacitance Parameters of Three Dimensional Interconnect Structures Based on Finite Element Method

Fast Parameters Extraction of Multilayer and Multiconductor Interconnects Using Geometry Independent Measured Equation of Invariance

Fast Extraction of the Capacitance Matrix of Multilayered Multiconductor Interconnects Using the Method of Lines