Abstract:In recent years, the rapid development of industry makes the proportion of interconnect in chip increase rapidly. In order to ensure the stability and reliability of the circuit, accurate 3D modeling and high efficiency parasitic parameter extraction are needed for the chip interconnect. This paper has carried out the research on the extraction of capacitance parameters of the 3D finite element interconnection line. Starting from the principle of multi-conductor capacitance calculation, the problem is reduced to solving the Laplace equation for point boundary conditions. By using the finite element method (FEM), the solving process is analyzed and deduced. In addition, based on the high-efficiency parallel support software framework JAUMIN, this paper realizes the parallel calculation of the three-dimensional finite element capacitance parameter extraction, which greatly improves the calculation efficiency. Finally, the algorithm is applied to a representative interconnect structure. The calculation results are compared with the multi-physics commercial simulation software COMSOL. The results show that the potential distribution diagram is consistent.

Fast algorithm for the parameter extraction of multilayered multiconductor interconnections. Finite difference-measured equation of invariance method

Parameters Extraction Of Multilayer And Multiconductor Interconnects Using Geometry Independent Measured Equation Of Invariance

Fast Parameters Extraction of Multilayer and Multiconductor Interconnects Using Geometry Independent Measured Equation of Invariance

Fast Parameter Extraction for Multiconductor Interconnects in Multilayered Dielectric Media Using Mixture Method of Equivalent Source and Measured Equation of Invariance

Capacitance extraction of high-density 3D interconnects using finite element method

Capacitance Extraction of Three-Dimensional Interconnects Using Element-By-Element Finite Element Method (Ebe-Fem) and Preconditioned Conjugate Gradient (pcg) Technique

COMBING MULTILEVEL GREEN'S FUNCTION INTERPOLATION METHOD WITH VOLUME LOOP BASES FOR INDUCTANCE EXTRACTION PROBLEMS

Fast parameter extraction of general interconnects using geometry independent measured equation of invariance

Characterization Of Near-Field Coupling Effects From Complicated Three-Dimensional Structures In Rectangular Cavities Using Fast Integral Equation Method

A new multilevel Green's function interpolation method for large-scale low-frequency EM simulations

Fast Extraction of the Capacitance Matrix of Multilayered Multiconductor Interconnects Using the Method of Lines

A New Multilevel Green's Function Interpolation Method for Large Scale EM Simulations in RF ICs

Study on Extraction of Capacitance Parameters of Three Dimensional Interconnect Structures Based on Finite Element Method

On-chip Interconnect Inductance Extraction Using Fast Multipole Method

MEI method solution based on total charge Green's function for multiconductor interconnects modeling in very high speed integrated circuits

Electrical performance simulation of inhomogeneous multilayer LTCC structure by hybrid method

Finite-difference Time-Domain Macromodel for Simulation of Electromagnetic Interference at High-Speed Interconnects

A Generalized algorithm for the capacitance extraction of 3-D VLSI interconnects

Fast multipole integral equation method for VLSI interconnect inductance calculation

Electromagnetic Modelling and Transient Simulation of Interconnects in High Speed VLSI Circuits

Domain decomposition method and its applications in parameter extraction of 3-D complex multilayered and multiconductor interconnects