Abstract:This paper presents an accurate and systematic approach for analysis of the signal integrity of the high-speed interconnects, which couples the full-wave finite difference time domain (FDTD) method with scattering (S) parameter based macromodeling by using rational function approximation and the circuit simulator. Firstly, the full-wave FDTD method is applied to characterize the interconnect subsystems, which is dedicated to extract the S parameters of the subnetwork consisting of interconnects with fairly complex geometry. Once the frequency-domain discrete data of the S parameters of the interconnect subnetwork is constructed, the rational function approximation is carried out to establish the macromodel of the interconnect subnetwork by employing the vector fitting method, which provides a more robust and accurate solution for the overall problem. Finally, the analysis of the signal integrity of the hybrid circuit can be fulfilled by using the S parameters based macromodel synthesis and simulation program with integrated circuits emphasis (SPICE) circuit simulator. Numerical experiments demonstrate that the proposed approach is accurate and efficient to address the hybrid electromagnetic (interconnect part) and circuit problems, in which the electromagnetic field effects are fully considered and the strength of SPICE circuit simulator is also exploited.

Electromagnetic Modelling and Transient Simulation of Interconnects in High Speed VLSI Circuits

Electromagnetic modeling and transient simulation of interconnects in high speed VLSI

Electromagnetic modeling and transient simulation of multiconductor transmission line in high speed VLSI

Parallel Electromagnetic Modeling for Connectors Based on Domain Decomposition Preconditioners

Electrical Modeling of Three-Dimensional Carbon-Based Heterogeneous Interconnects

Electro-Thermo-Mechanical Investigation On Multi-Level Interconnects In The Presence Of An Esd Pulse

An Equivalent Circuit Model with Current Return Path Effects for On-Chip Interconnect Up to 80 Ghz

Finite-difference Time-Domain Macromodel for Simulation of Electromagnetic Interference at High-Speed Interconnects

Electrothermal investigation on through silicon multi-walled carbon nanotube via interconnects

Fast Electromagnetic Modeling of 3d Interconnects on Chip-Package-Board

A Novel Integrated Approach for Simulation of Electromagnetic Susceptibility Problem

Electromagnetic Modeling And Simulation For Packaging Structures With Lossy Conductors

Method for system-level signal and power integrity modeling of high-speed electronic packages

Signal Integrity Simulation and Analysis in High-Speed Interconnects by Using FDTD

A Systematic Electromagnetic-Circuit Method for Emi Analysis of Coupled Interconnects on Dispersive Dielectrics

A Coupled Efficient and Systematic Full-Wave Time-Domain Macromodeling and Circuit Simulation Method for Signal Integrity Analysis of High-Speed Interconnects

Electromagnetic Modeling of Lossy Interconnects From DC to High Frequencies With a Potential-Based Boundary Element Formulation

High Frequency Characterization and Modeling of VLSI On-Chip Interconnects

Efficient, Simulation of Power Distribution Network by Using Integral-Equation and Modal-Decoupling Technology

Electromagnetic Modeling for Lossy Interconnect Structures Based on Hybrid Surface Integral Equations

Accurate Electromagnetic Analysis for Multilayered Interconnect Structures Based on VSIEs