State-of-the-art of Ultrasonic Transducer Research in Microelectronics Packaging

Yunxin Wu,Zhili Long,Lei Han,Jue Zhong
DOI: https://doi.org/10.3321/j.issn:1004-132X.2008.11.026
2008-01-01
Abstract:Ultrasonic transducer is the key component in the microelectronics packaging machine, and its working performance directly influences the bonding quality. The present research on ultrasonic transducer system was summarized by our recent researches herein. The theory modeling and design process were discussed, which included numerical analysis, transfer matrix, equivalent circuit method and finite element analysis. By our experimental measurements, the shortcomings for current bonding transducer were summarized. The development trend of the transducer system, which met for the SIP (system in packaging) in the future, was pointed out. Some useful suggestions for improving the working performance of the transducer were brought forward, which are of great significance to develop the bonding transducer in China.
What problem does this paper attempt to address?