A method of precise orientation of wafer prealignment

Chunxia Huang,Qixin Cao,Renqiang Liu
DOI: https://doi.org/10.3321/j.issn:1002-0470.2007.07.010
2007-01-01
Abstract:Aiming to traditional wafer prealingers' deficiencies in the precision of prealignment and spacing consuming in the manufacture of integrated circuits, a new wafer prealigner was proposed using a high-precision laser displacement sensor and a low-cost transmission laser sensor as detectors, and correspondingly a precise prealignment algorithm was developed based on the features of the system, and the experiment of prealignment precision testing was performed. The periphery of the wafer was detected by means of the two sensors' integration, the eccentricity of the wafer and the orientation of the notch were calculated by means of byracenter acquiring algorithm among one particle system, the micron-rank prealignment precision was achieved at the end. The proposed system has enhanced the precision of prealignment, saved the occupation of the space and decreased the cost. Experimentation has proved the validity and effectiveness of the system.
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