Diffusion bonding of Ti-6Al-4V to ZQSn10-10 in vacuum

Minxia Song,Xihua Zhao,Wei Guo,Jicai Feng,Da Huang

2007-01-01

Abstract:The experimental investigation of the direct diffusion bonding of Ti-6Al-4V to ZQSn10-10 was carried out in vacuum. The microstructure of bonded joint was studied by scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and the mechanical properties were detected by the tensile experiments. The microstructure and tensile strength of the joint mainly depend on the bonding temperature and bonding time. A satisfying diffusion bonded interface with a tensile strength of 73.9 Mpa can be obtained under the condition of bonding temperature 850°C for 30 min. Three kinds of reaction products were observed in the bonded interface, namely β-Ti, Cu 3Ti and CuSn 3Ti 5. And the brittle Cu 3Ti and CuSn 3Ti 5 are mainly responsible for lowering the strength of the bonded joint. The diffusion distances of Sn, Cu and Ti and square root of bonding time are approximately linear relationship. And diffusion velocity of Sn, Cu and Ti in the diffusion reaction layer are 0.0139, 0.0697 and 0.0564 mm 2/s.