Abstract:Thermal issue has significant effect on the reliability and performance of integrated circuits (ICs) with the increase of integrated density, especially for 2.5-D and 3-D heterogeneous integration packaging systems. In this paper, a new highly efficient 3-D transient thermal distribution model has been constructed to capture the heat conduction behavior of multiple heat sources for chiplet heterogeneous integration (CHI) by improving the alternating direction implicit finite difference method (ADI-FDM). Firstly, a new floating optimization algorithm (FOA) of coefficient matrix assignment of heat conduction equation and a new boundary treatment utilizing virtual points are proposed to modify the ADI-FDM and improve the model efficiency of thermal analysis. Furthermore, a universal equivalent thermal conductivity model is also built up to describe the design features of through silicon via (TSV), bump and redistribution layer structures, which can enhance the flexibility of FDM-based thermal simulator. Compared with previous finite element analysis results, the present FOA-accelerated thermal model can not only obtain an accurate simulation result of temperature profile, but also give a simulation efficiency of 3.74 times faster than Douglas-Gunn approach for the coefficient matrix assignment. Finally, the effect of power consumption variation and the floorplaning effects of chiplets, TSVs and bumps on the temperature distribution are investigated in detail by utilizing the present FOA-based thermal solver. The simulated results of the present work demonstrate the viability and computational efficiency for temperature field optimization and indicate that the new proposed simulator is helpful in thermal analysis of packaging structures and can be adopted to assist in physical design optimization of 2.5-D CHI or 3-D heterogeneous stacked chips.

Analytical Thermal Analysis of On-chip Interconnects

Electromagnetic-Thermal Characterization Of On On-Chip Coupled (A)Symmetrical Interconnects

Thermal-aware electrical analysis of high-speed interconnect

High-Frequency Electrothermal Characterization of TSV-Based Power Delivery Network

Modeling and Characterization of On‐Chip Interconnects

Transient Electrothermal Analysis of Interconnects in the Presence of a ESD pulse

Wide-band characterization of average power handling capabilities of some microstrip interconnects on polyimide and polyimide/GaAs substrates

Analysis and Optimization of Thermal-Driven Global Interconnects in Nanometer Design

A Thermal Network Model for Multichip Power Modules Enabling to Characterize the Thermal Coupling Effects

Efficient Thermal Analysis Method for Large Scale Compound Semiconductor Integrated Circuits Based on Heterojunction Bipolar Transistor

Thermal Analysis on Active Heat Dissipation Design with Embedded Flow Channels for Flexible Electronic Devices

A Novel Analytical Thermal Model for Temperature Estimation of Multilevel ULSI Interconnects

Efficient Transient Thermal Analysis of Chiplet Heterogeneous Integration

Thermal Modeling, Characterization And Management Of On-Chip Networks

Transient Heat Conduction in On-Chip Interconnects Using Proper Orthogonal Decomposition Method

Study on Self-Heat Effects in Integrated Circuits with Hot-Spot and Electro-Thermal Coupling Methods

A Low Computational Cost and Accurate Thermal Calculation Method for Multi-hotspot IC

Thermal-aware Power Network Design for IR Drop Reduction in 3D ICs.

The thermal stress analysis in 3D IC integration with TSV interposer

Thermal Characteristic Investigation for a Multichip Module Based on APDL

Adaptive Chip-Package Thermal Analysis for Synthesis and Design