Dynamic Operational Stress Measurement of MEMS Using Time-Resolved Raman Spectroscopy
James W. Pomeroy,Petros Gkotsis,Meiling Zhu,G. Leighton,Paul Kirby,Martin Kuball,J.W. Pomeroy,P. Gkotsis,M. Zhu,P. Kirby,M. Kuball
DOI: https://doi.org/10.1109/jmems.2008.2004849
IF: 2.829
2008-12-01
Journal of Microelectromechanical Systems
Abstract:A dynamic-stress analysis method, based on time-resolved micro Raman spectroscopy, has been developed for reliability studies of microelectromechanical systems. This novel technique is illustrated by measuring temporally and spatially resolved stress maps of a piezoelectrically actuated silicon microcantilever when driven at its first- (6.094 kHz) and second-order (37.89 kHz) resonant frequencies. Stress amplitudes of up to 180 ± 10 MPa were measured at the maximum stress locations. The time-resolved Raman stress measurements are compared to the results of finite-element analysis and laser Doppler vibrometry.$\hfill$[2008-0003]
engineering, electrical & electronic,nanoscience & nanotechnology,instruments & instrumentation,physics, applied