Abstract:Predictive analysis of the life of an electronic package requires a sequence of processes involving: (i) development of a finite element (FE) model, (ii) correlation of the FE model using experimental data, and (iii) development of a local model using the correlated FE model. The life of the critical components is obtained from the local model and is usually compared to the experimental results. Although the specifics of such analyses are available in the literature, a comparison among them and against the same electronic package with different user printed circuit board (PCB) thicknesses does not exist. This study addresses the issues raised during the design phase/life analysis, by considering a particular package with a variable geometric thickness of the user PCB. In this paper, the effect of stiffening the user PCB on the fatigue life of a ball grid array (BGA), SAC305 solder joint is studied. The board stiffness was varied by changing the thickness of the PCB, while the size of the substrate, chips, and solder balls were kept constant. The test vehicle consisted of BGA chips soldered to a user PCB. The thickness of the user PCB was varied, but the surface area of the BGA chip remained identical. The test vehicle was then modeled using a finite element analysis tool (ANSYS). Using a global/local modeling approach, the modal parameters in the simulations were correlated with experimental data. The first resonance frequency dwell test was carried out in ANSYS, and the high-cycle fatigue life was estimated using the stress-life approach. Following the simulation, the test vehicle was subjected to resonance fatigue testing by exciting at the first mode resonance frequency, the mode with the most severe solder joint failure. The resistance of the solder joint during the experiment was monitored using a daisy-chain circuit, and the point of failure was further confirmed using the destructive evaluation technique. Both the experimental and simulation results showed that stiffening the board will significantly increase the fatigue life of the solder joint. Although the amplitude of the acceleration response of the test vehicle will be higher due to board stiffening, the increase in natural frequencies will significantly reduce the amplitude of relative displacement between the PCB and the substrate.

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Simulation Study on Thermo-Fatigue Failure Behavior of Solder Joints in Package-On-Package Structure

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Comprehensive Study on 2.5D Package Design for Board-Level Reliability in Thermal Cycling and Power Cycling

Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test

Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions

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Finite Element Simulation Study of Interfacial Crack Propagation in the Underfilled FC-BGA Package

Internal Bump Cracking Risk Assessment for Flip Chip Ball Grid Array Package During Board Level Reliability Test Through Finite Element Analysis

Vibration fatigue experiments of SMT solder joint

Fatigue Life Prediction for Cbga under Random Vibration Loading by Finite Element Method

Thermal Fatigue Modelling and Simulation of Flip Chip Component Solder Joints under Cyclic Thermal Loading

Thermal Stress Measurement of Solder Joints in Bga Packages: Theoretical and Experimental

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Thermal fatigue test of electronic packages under temperature cycles

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Board Level FBGA Package Combined Thermal Cycling &amp; Bending Fatigue Study