A Novel Surface-Micromachined Structure For On-Line Measuring Thermal Expansion Coefficient of Polysilicon Thin Films

Yuxing Zhang,Qing'an Huang,Weihua Li
DOI: https://doi.org/10.3969/j.issn.1674-4926.2005.04.041
2005-01-01
Abstract:This paper presents a novel structure for in situ determining thermal expansion coefficient of polysilicon thin films. A thermal-electro-mechanical compliant model is provided and confirmed with ANSYS software and some optimized parameters are also achieved through simulations. The structure has many advantages such as high precision without any particular requirements (vacuum or sealed chamber). Furthermore, the results of test are all presented in electrical form.
What problem does this paper attempt to address?