Quasi-Static Parameter Analysis for Arbitrary Metallization Thickness of RF MEMS Coupled Microstrip Lines

Jia-Hui Fu,Qun Wu,Yue-Mei Qin,Xue-Mai Gu
DOI: https://doi.org/10.1109/aps.2005.1552031
2005-01-01
Abstract:The paper describes a method to analyze arbitrary metallization thickness on a coupled microstrip line for RF MEMS passive device design. Using a conformal mapping technique, closed-form expression quasi-static parameters for the metallization thickness of coupled microstrip lines are determined. They are found to be accurate compared with simulation tools. By using this method, the even-odd mode impedance of coupled microstrip lines for arbitrary metallization thickness can be obtained.
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