Optimizing boron implantation dose of HgCdTe infrared detectors

Guibin Chen,Wei Lü,Weiying Cai,Zhifeng Li,Xiaoshuang Chen,Xiaoning Hu,Li He,Xuechu Shen
DOI: https://doi.org/10.7498/aps.53.911
2005-01-01
Abstract:Using the material chip technology, large area photodiodes of n-on-p structure with different boron implantation dose are fabricated on the Hg1-xCdxTe film for mid-infrared wavelength region (x = 0.291). Current-voltage characteristics of the photodiodes are measured at 77K and zero bias resistance-area products of different photodiodes are fitted from the data in the voltage range of -0.2-0.08 V. The study indicated that the R0A products of different elements depended distinctly upon the implanted boron dose. A large R0 value has been also obtained in another chip with x = 0.2743. All the samples in this study are grown by Riber 32P molecular-beam epitaxy system and all the junctions-forming process is the same as the standard planar technology but using a series of metallic masks during the boron ion implantation.
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