Electroless plating of silver nanoparticles on silica spheres

Lei Huang,Guoping Ling,Chao Zhang,Jianping Li
2004-01-01
Abstract:This paper discusses a new method by which silver is deposited on silica spheres by means of electroless plating. Silica spheres, 300 nm in diameter, were dispersed in an ammoniated AgNO3 solution containing formaldehyde (HCHO) as a reducing agent. Plating was carried out at room temperature with ultrasonic radiation. Transmission electron microscopy (TEM) revealed that silver particles on the silica surface were about 50 nm in diameter. X-ray diffraction (XRD) indicated that the plated layer was silver. In order to improve the continuity and uniformity of the silver nanoshell, silica spheres, precoated with copper were used. TEM revealed that more particles with a diameter of 20 nm were deposited on the silica spheres. By increasing the copper content of the Cu-coated powder, a uniform and homogeneous Cu-Ag film was produced on the surface of the silica powder.
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