Interfacial voids and microstructure evolution, bonding behavior and deformation mechanism of TC4 diffusion bonded joints
Yu Peng,Jinglong Li,Zhaoxi Li,Shiwei Li,Wei Guo,Xiangyu Gao,Jiangtao Xiong
DOI: https://doi.org/10.1016/j.jmapro.2022.07.037
IF: 5.684
2022-09-01
Journal of Manufacturing Processes
Abstract:The interfacial voids closure and related microstructure evaluation of diffusion bonding process was studied by the method of combining simulation and experiment on TC4 joints. It was found that the interfacial microvoids of joints transformed narrow oval to rounded circle with the increase of bonding time. Meanwhile, the distance of two adjacent interfacial microvoids increased, indicating the improvement of the bonded ratio. At the tip of microscopic convex region, the initial boundary was replaced by recrystallized grains. At the voids neck region, the initial bonding interfaces were replaced by straight grain boundary for the inadequate deformation, resulting from the incomplete driven force of recrystallization and grain boundary migration. The bonded interface developed from straight grain boundary to grains across the original interface. The evolution of Mises equivalent stress fields and the local strain fields of the interfacial region were by Finite Element Analysis (FEA) method. The results indicated that the stress at the asperity tip region was always higher than that at the neck of the void. The distribution of dislocations on the bonding interface region demonstrated that the grain boundary migration was controlled by the multiple slip of dislocations, which controlled by Power-Law Creep mechanism.
engineering, manufacturing