New model of interfacial physical contact in diffusion bonding

h e peng,Jicai Feng,YiYu Qian
IF: 10.319
2009-01-01
Journal of Materials Science and Technology
Abstract:Through eliminating voids which did not affect the primary bonding process and incorporating interlayer and flexible base material, the interface geometry character and the brief mathematics process were put forth. Through analyzing the contact process of diffusion bonding, the contact area model was settled. It can interpret the phenomenon of different interface areas taking on different strengths. In the course of physical contact, shear stresses serve an important function for the plastic deformation and the cohesion of interface voids.
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