Abstract:Using the complex image method (CIM), we have analyzed the frequency and temperature dependencies of substrate eddy currents for single-ended and differential spiral inductors on a lossy silicon substrate. From our analysis, we have derived a set of accurate closed-form expressions for calculating inductances and substrate losses due to substrate eddy currents. Here, we propose a frequency-dependent eleven-element equivalent circuit model based on these formulas. We established the validity of the model by comparing the simulated and measured results, which are in good agreement. Index Terms—Complex image method (CIM), differential inductor, eddy currents, greenhouse algorithm, inductor model. HE high operating frequencies, at which deep submicrom- eter and nano-scale CMOS devices are able to operate, have brought radio-frequency integrated circuits (RFICs) in the realm of CMOS making the quality factor of the on-chip spiral inductors a focus of intense research. The quality factor of the on-chip inductor is limited by the losses due to the finite conduc- tivity of the metal and the conducting silicon substrate. Non-per- fect metal wires used to form spiral inductors cause ohmic loss due to the non-zero resistance at low frequencies. Additionally the non-uniform current distribution in metal wires at high fre- quencies increases the losses and degrades the quality factor of inductors. This loss mechanism has been extensively studied as skin- and proximity-effect (1)-(12).

High-Performance Edge-Suspended Spiral Inductors And Cpws On Cmos-Grade Silicon Substrates

High-Q CMOS-compatible micromachined edge-suspended spiral inductors

CMOS-Compatible Micromachined Edge-Suspended Spiral Inductors With High Q-Factors and Self-Resonance Frequencies

CMOS-compatible micromachining techniques for fabricating high-performance edge-suspended RF/microwave passive components on silicon substrates

Modelling On-Chip Circular Double-Spiral Stacked Inductors for RFICs

On-chip EMC issue: the implementation of patterned ground shields for silicon devices

A Compact Circuit Model of On-Chip Multi-layer Spiral Inductors on Silicon Substrate

The enhancement of Q factor for patterned ground shield inductors at high temperatures

PERFORMANCE TRENDS OF ON-CHIP SPIRAL INDUCTORS FOR RFICS

Model Description and Parameter Extraction of On-Chip Spiral Inductors for MMICs

Fabrication of High-Performance On-Chip Suspended Spiral Inductors by Micromachining and Electroless Copper Plating

High-Performance CMOS-Comp Edge-Suspended Coplanar W Resistivity Silicon

A derived circuit model for spiral inductors on lossy silicon substrate

Implementation of New CMOS Differential Stacked Spiral Inductor for VCO Design

Double-level Spiral Inductors with Multiple-Via Interconnects on GaAs Substrates

Experimental Characterisation Of On-Chip Octagonal Double-Helix Inductors On Silicon Substrates

Analysis of Frequency- and Temperature-Dependent Substrate Eddy Currents in On-Chip Spiral Inductors Using the Complex Image Method

Global Performance Evaluation of Various On-Chip Square Spiral Inductors on Gaas Substrates

Design and Fabrication of the Suspended High-Q Spiral Inductors with X-Beams

High-performance CMOS-cornpatible Micromachined Edge-Suspended Coplanar Waveguides on Low Resistivity Silicon Substrate

High Q-factor CMOS-MEMS inductor