Abstract:This study aims to facilitate the assessment of the electromagnetic-electrical-thermal coupled response of a developed 30 kHz/12 kW silicon carbide (SiC)/silicon (Si) hybrid power-integrated module (hPIM) during load operation. To achieve this goal, an efficient electromagnetic-circuit-thermal coupling (ECTC) analysis methodology is introduced. This ECTC methodology incorporates a fully integrated electromagnetic-circuit coupling (EMCC) analysis model for parasitic extraction in order to addressing their effects on power losses, and a simplified electrothermal coupling (SETC) analysis model for temperature evaluation in order to consider the coupling influence of the instantaneous junction temperature on instantaneous power losses. The SETC model couples a simple lookup table that maps the power loss (P) in terms of the temperature (T) constructed using the developed EMCC model, and an equivalent Foster thermal network model established through three-dimensional (3D) computational fluid dynamics (CFD) thermal flow analysis. This PT lookup table, replacing the tedious and time-consuming EMCC simulation, is responsible for fast estimation of temperature-dependent power losses. The proposed analysis models, namely the CFD, EMCC, and SETC analysis models, are validated through thermal experiments and detailed modeling. Finally, the influence of various operation conditions on the power losses of the hPIM during the power conversion operation is explored through parametric analysis.

MUTUAL INDUCTANCE COUPLING RESEARCH BASED ON PEEC THEORY INSIDE HYBRID IPEM

EMI Research Based on Mutual Inductance Model Inside Hybrid IPEM

Analysis of Electromagnetic Coupling in Hybrid Integrated Power Electronic Module

Power Circuit's Thermal Effect to Drive/Protection Circuits Inside Hybrid IPEM

Modeling of Conducted EMI in Motor Drive System Based on Double Pulse Test and Impedance Measurement

Characterization of Mutual Coupling Effects among Multi-Antennas Mounted on a Perfect Electrically Conducting (PEC) Tower Platform in the Presence of Intentional Electromagnetic Pulses (Iemps)

Design of Inductively Coupled Energy Transfer System

Investigation of Power Distribution Planes with Multi-Slots Using Plane-pair PEEC Method

Electromagnetic Coupling Estimation Based on Hybrid Equivalent Dipoles and Field-Circuit Models

Plane-pair PEEC method for impedance analysis of multi-slots power distribution network with experimental validation

Plane-Pair PEEC Modeling for Package Power Layer Nets with Inductance Extraction

A PEEC-Based Concise Broadband Physical Circuit Modeling Method with Parameter Extraction for PCB Inductive Components

Integral-Equation Equivalent-Circuit Method for Modeling of Noise Coupling in Multilayered Power Distribution Networks

Emission and Susceptibility Modeling of Finite-Size Power-Ground Planes Using a Hybrid Integral Equation Method

Parasitic Parameter Extraction and Loss Analysis of A 3kw MOSFET Hybrid Integrated Power Electronics Module (IPEM) for Three-phase Motor Driver

An Integral Equation Hybrid Method for the Impedance Calculation of the Grid Power Distribution Network with an Arbitrary Shape

Hybrid of Scattering Matrix Method and Integral Equation Used for Co-simulation of Power Integrity and EMI in Electronic Package with Large Number of P/G Vias

Study of Thermal Effect of Power Circuit on Driver & Protection PCB in Hybrid IPEM

PEEC Modeling and Model Order Reduction of Magnetically Enhanced Planar Inductive Device

Power Loss and Electrothermal Characterization of Hybrid Power Integrated Modules for Industrial Servo Motor Drives

Design and Evaluation of an Input Active EMI Filter for Integrated Power Electronics Modules