Investigation on Thermal Stress–induced Bending of Copper Foil Using Pulsed Arc Plasma
Xiaoming Duan,Zongyu Du,Jun wang,Izaro Ayesta,Yifan Wang,Kenan Deng,Xiaodong Yang
DOI: https://doi.org/10.1007/s00170-024-14349-2
IF: 3.563
2024-01-01
The International Journal of Advanced Manufacturing Technology
Abstract:Low-cost micromanufacturing technique for forming copper foils into desired micro-parts plays an important role in facilitating the widespread application of copper foil. Here, the pulsed arc plasma generated by the pulsed voltage was used as a heat source to achieve thermal stress–induced bending of copper foil in an electrical discharge machining (EDM) machine. Metallic foil with a thickness of 0.1 mm and a cylindrical rod with scanning motion were used for the first time as tool electrodes in the EDM bending of workpieces. The effect of various processing parameters, such as polarity, machining time, discharge current, duty factor, and discharge frequency, on the bending angle was investigated by optical microscopy. The main factors affecting the bending angle and their working mechanisms were analyzed in depth. Experimental results showed that the bending angle of the copper foil increases with the increase of the discharge energy, which was mainly attributed to the increasing thermal gradient along the thickness direction of the copper foil. When the copper foil was used as the anode, the carbon deposition phenomenon in the copper foil effectively reduced the material removal caused by the pulsed arc plasma, which contributes to the surface integrity and performance of the copper foil. Furthermore, several typical bend-formed parts, including curved, sawtooth, and S-shapes, were formed using pulsed arc plasma. This work proves that pulsed arc plasma is a reliable and cost-effective heat source for achieving thermal stress–induced bending of copper foil.