Joining of Si3N4 Ceramics with In-situ Formed Oxynitride Glass Interlayer
LIU Chunfeng,YU Hongjiang,LIN Yingkui,ZHANG Jie,YE Feng,HUANG Yudong
DOI: https://doi.org/10.7521/j.issn.0454-5648.2013.02.24
2013-01-01
Abstract:The Si3N4–Al2O3–Y2O3–SiO2 powder mixture was used to join Si3N4to itself by in-situ formed oxynitride glass interlayer.Effects of temperature,pressure and atmosphere on bonding strength and microstructure of joints were investigated.Under 0.1 MPa argon,a few holes can be found in the joint and slight decomposition of Si3N4matrix occurred.Under 0.1 MPa nitrogen,the stability of Si3N4matrix can be preserved,and no pores appear in the joint.Amount of β-sialon phases can be observed,which distribute uniformly in the oxynitride glass interlayer.While under 0.5 MPa nitrogen,Si3N4 ceramics cannot be joined.The influence of bonding pressure on joints is bounded by joining temperature.When temperature is low,the bonding strength of joints can be improved with the increase of pressure from 0.6 to 1.5 MPa.When increasing temperature,the strength presents peak value at 1 550 ℃.Moreover,the influence of pressure on joint is weakened.At higher joining temperature,liquid solder is ready to flow out of the seam under higher pressure,and ceramic matrix also tends to deform.