Correlation Between the Morphology of Ag and the Contact Resistivity of the Ag/YBa2Cu3O7−δ Thin Film Contact

T. Liu,Y. G. Zhao,T. B. Li,M. H. Zhu,L. W. Zhang,H. S. Huang,M. L. Liu,Y. L. Zhou,M. He,H. B. Lu,B. S. Cao
DOI: https://doi.org/10.1023/a:1011103228315
2001-01-01
Journal of Superconductivity
Abstract:The morphology of the silver films deposited and annealed on laser ablated YBa2Cu3O7−δ thin films and the corresponding contact resistivity have been systematically investigated. A minimum contact resistivity of 6 × 10−8 Ω cm2 was reached at 77 K by annealing Ag/YBa2Cu3O7−δ contact at the optimum temperature. The effect of the annealing temperature on the contact resistivity was explained by considering the morphology of the silver films and the diffusion of silver into YBa2Cu3O7−δ film, etc. The difference of the contact resistivity for Ag contact to polycrystalline, single crystal and thin film of YBa2Cu3O7−δ were also explained.
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