Electrochemical Studies Of Electrodeposition Of Nickel For Liga Microstructures

Guifu Ding,Yimin Zhang,Jingquan Liu,Xioalin Zhao,Binchu Cai,Tianhui H. Shen
DOI: https://doi.org/10.1117/12.444706
2001-01-01
Abstract:The comparison of Nickel electrodeposition in LIGA process with traditional electroplating by electrochemical methods was reported.The mass transport limitation during microelectroforming in LIGA was studied by linear potential sweep technique, the limiting current is easier to reach for plating into LIGA molds. The A.C. impedance measurement also supports the above viewpoint, beside this, it seems that the mechanism of electrode reaction also differ from that of conventional nickel plating.A semi-automatic electroforming equipment for LIGA process has been developed, various nickel microstructures with high aspect ratios have been fabricated in this equipment. a series of micro nickel gears have been fabricated, an advanced micro gear-box with 2mm diameter has been assembled, it works very well.
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