Surface Tension and Screen Printing Precision

TX Liang,WZ Sun,MB Tian,YH Wang,HD Li

1996-01-01

Abstract:> With continued demands for better performance of VLSI,the electronic industry haspaid much attention to packaging technology.Thick-film technology is important in pack-age.The increases of circuit densities in high-density microelectronic packaging requestreduction of the width of printing lines.

What problem does this paper attempt to address?

Dynamics of Liquid Transfer from Nanoporous Stamps in High-Resolution Flexographic Printing

Dhanushkodi D. Mariappan,Sanha Kim,Michael S. H. Boutilier,Junjie Zhao,Hangbo Zhao,Justin Beroz,Ulrich Muecke,Hossein Sojoudi,Karen Gleason,Pierre-Thomas Brun,A. John Hart

DOI: https://doi.org/10.1021/acs.langmuir.9b00460

IF: 3.9

2019-01-01

Langmuir

Abstract:Printing of ultrathin layers of polymeric and colloidal inks is critical for the manufacturing of electronics on nonconventional substrates such as paper and polymer films. Recently, we found that nanoporous stamps overcome key limitations of traditional polymer stamps in flexographic printing, namely, enabling the printing of ultrathin nanoparticle films with micron-scale lateral precision. Here, we study the dynamics of liquid transfer between nanoporous stamps and solid substrates. The stamps comprise forests of polymer-coated carbon nanotubes, and the surface mechanics and wettability of the stamps are engineered to imbibe colloidal inks and transfer the ink upon contact with the target substrate. By high-speed imaging during printing, we observe the dynamics of liquid spreading, which is mediated by progressing contact between the nanostructured stamp surface and by the substrate and imbibition within the stamp-substrate gap. From the final contact area, the volume of ink transfer is mediated by rupture of a capillary bridge; and, after rupture, liquid spreads to fill the area defined by a precursor film matching the stamp geometry with high precision. Via modeling of the liquid dynamics, and comparison with data, we elucidate the scale- and rate-limiting aspects of the process. Specifically, we find that the printed ink volume and resulting layer thickness are independent of contact pressure; and that printed layer thickness decreases with retraction speed. Under these conditions, nanoparticle films with controlled thickness in the <100 nm regime can be printed using nanoporous stamp flexography, at speeds commensurate with industrial printing equipment.
High Resolution Direct Writing Liquid Metal Patterns for Printed Stretchable Electronics

Bo Liang,Jinwei Wei,Lu Fang,Qingpeng Cao,Tingting Tu,Xuesong Ye

DOI: https://doi.org/10.1109/icsens.2018.8589772

2018-01-01

Abstract:A rapid and inexpensive method to produce stretchable liquid metal electronics with high resolution is introduced. Here, liquid phase gallium-indium (Gain) alloy is firstly patterned on a pre-stretched elastomer, followed by a natural shrinking process to achieve high resolution stretchable electronic components and interconnects. The idea is inspired from the inflation and deflation of patterned balloons. By a cascaded direct writing and transfer printing step, the printing resolution increases by 20 times on pre-stretched substrates. This rapid prototyping approach paves a new way for microscale printed stretchable electronics.
Effect Of Surface Energies On Screen Printing Resolution

T.-X. Liang,W. Z. Sun,L.-D. Wang,Y. H. Wang,H.-D. Li

DOI: https://doi.org/10.1109/96.496047

1996-01-01

Abstract:The influence of surface energies on Line resolution in screen printing was studied in this paper, Ink wettability on surfaces is decreased by decreasing the surface energies of substrates-the reduction in wettability improves the line resolution, For such high surface-energy substrates as ceramics, the effective means to improve the line resolution is to use high thixotropic inks. On the other hand, for low surface energy polymer substrates, the line resolution can be heightened by increasing the surface energies of inks, If the critical surface tension of a substrate is lower than the surface energy of inks, good line resolution can be achieved even though low viscosity inks were used, The use of low viscosity inks has quite a lot of advantages.
Research on Surface Modification of Screen Printing Electronics

Ye Tian,Yan Li,Ying-Cai Yuan,Lin Zhao,Gao-Shen He,Tuo-Kai Peng,Jian-Lin Xu

DOI: https://doi.org/10.21203/rs.3.rs-936681/v1

2021-09-30

Abstract:Abstract Printing electronic components by screen printing with its excellent printing quality, high efficiency, and green environmental protection have broad application prospects in additive manufacturing. However, efficiency and quality of printing were decreased as conductive-ink blocking screen in the actual process of printing. Thus, it is pivotal that exploring factors of adhesion from the interaction of conductive-ink and screen. Herein, the functional relationship between adhesion and factors of adhesion and influence trend of adhesion on ink residue was obtained via the establishment of liquid-bridge adhesion model between two plates according to screen printing ink transfer process, solid-liquid wetting theory, and adhesion mechanism, which was verified by software Fluent. In order to justify the accuracy of the model and simulation, the adhesion and ink residue were tested on the surface-modified glass sheet as the result that the model and simulation were consistent with the experimental record. It was demonstrated that solid-liquid contact angle, tensile distance, and liquid volume are the main factors affecting the change of solid-liquid adhesion. With the increase of tensile distance and contact angle, the adhesion force decreases, which causes the decline of the residual amount of liquid on the solid surface. By means of screen modification, the adhesion between conductive-ink and screen can be reduced, as meanwhile the efficiency and quality of printed products can be improved.
Recent Advances on Mechanics of Transfer Printing for Flexible and Stretchable Electronics

HongYu LUO,ChangHong LINGHU,JiZhou SONG

DOI: https://doi.org/10.1360/sspma2018-00136

2018-01-01

Abstract:Flexible and stretchable inorganic electronics, offering the high performance of conventional electronics with the ability to be deformed like a rubber, integrate inorganic electronic materials with flexible substrates and has enabled many novel applications ranging from curvilinear electronics, epidermal electronics to bio-integrated electronics. However, inorganic electronic materials (e.g., silicon) cannot be fabricated directly on a flexible substrate due to the extreme processing conditions (e.g., high temperature). To overcome this challenge, transfer printing techniques have been developed to pick up inorganic thin films from the grown substrate and transfer them onto the receiver substrate for the heterogeneous integration. This approach separates the fabrication substrate with the application substrate and provides a most promising solution for the integration of inorganic electronic materials with flexible substrates to develop flexible and stretchable electronics. This paper provides a brief review of recent advances on mechanics of transfer printing techniques for flexible and stretchable inorganic electronics including kinetically controlled transfer printing technique, shear-enhanced transfer printing technique, gecko inspired transfer printing technique, surface-relief-assisted transfer printing technique, laser-driven transfer printing technique, bending curvature controlled transfer printing technique and tape transfer printing technique. The basic concepts for each transfer printing technique are overviewed to illustrate the key roles of mechanics in the development of transfer printing techniques. Despite the successful developments of various transfer printing techniques, several challenges still exist for future transfer printing techniques with the capabilities of transfer printing of nano-devices and direct three-dimensional transfer printing in a large-scale and high-efficiency manner.
Surface effects on the wrinkles in a stiff thin film bonded to a compliant substrate

Yuhang Li,Bo Fang,Jiazhong Zhang,Jizhou Song

DOI: https://doi.org/10.1016/j.tsf.2011.11.085

IF: 2.1

2012-01-01

Thin Solid Films

Abstract:Surface effects are important to predict the mechanical behavior of nanostructures. In this paper, the wrinkling of a stiff thin film bonded to a compliant substrate is studied using an energy method accounting for surface elasticity and residual surface tension. The wavelength, critical buckling strain and amplitude are obtained analytically. These results provide valuable guide to the precise design and control of the wrinkling profile in many applications ranging from stretchable electronics to micro/nano scale surface patterning and precision metrology.
Multi-step exposure method for improving structure flatness in digital light processing-based printing

Dai Xue,Yancheng Wang,Deqing Mei

DOI: https://doi.org/10.1016/j.jmapro.2019.02.013

IF: 5.684

2019-01-01

Journal of Manufacturing Processes

Abstract:Digital light processing (DLP)-based printing system equipped with ultraviolet (UV) source has been used to fabricate user-defined complex structures for biomedical applications. For printing large-scale structure, improving the structural consistency remains a challenge owing to the non-uniformly distributed UV light. Here, we present a multi-step exposure (MSE) method that takes advantage of a series of gradient digital masks to compensate the under-cured regions with additional UV exposure and eventually improve the surface flatness. First, for the established DLP-based printing system, the distribution of the UV power density is me asured and the relationship between the UV power density, exposure time and printing thickness are studied. The structure thickness can be calculated by the distribution of UV power density and exposure time. Then, the MSE method is proposed and an algorithm is customized to automatically modify the original mask into a series of gradient masks for MSE printing. Experimental validation was carried out by evaluating the morphologies of stripes printed without and with MSE. Printing of helix microfluidic chips revealed that the consistency of the channel thickness can be ensured by employing the MSE method. Thus, this MSE method for DLP-based printing is promising for printing large-scale structures with a consistent thickness and high resolution.
Interfacial Liquid Film Transfer Printing of Versatile Flexible Electronic Devices with High Yield Ratio

Yihao Chen,Xin Liu,Yinji Ma,Ying Chen,Bingwei Lu,Xue Feng

DOI: https://doi.org/10.1002/admi.202100287

IF: 5.4

2021-05-24

Advanced Materials Interfaces

Abstract:<p>Emerging flexible electronic devices differ widely in terms of material, shape, scale, and structure. The conventional solid-contact stamp transfer printing method easily causes cracks and interfacial delamination in large-area, intricately-patterned multilayered devices. Liquid film transfer printing (LTP) is presented as a strategy to obtain flexible devices with a high yield ratio regardless of the device material, scale, shape, and structure. In this technique, the liquid film is used to hydrolyze and break the chemical bonds between the film and silicon wafer substrate. Thus, there is less stress on the device during the transfer process. In addition, the buoyancy and surface tension of the liquid film help the flexible device to unroll itself on the liquid surface. In the experiments, flexible devices of different types and with extreme properties consistently achieved a transfer printing yield ratio of 98.57%. The sensitivity of temperature sensor change before and after LTP is less than 2%. The real-time and visualized comparisons of the stress distribution and evolution during LTP and solid-contact methods demonstrated that the LTP maximum strain is 70% smaller than the latter method. Thus, LTP has great potential for sophisticated and system-level flexible device transfer printing and integration.</p>

materials science, multidisciplinary,chemistry
Effects of Stamp Properties and Printing Pressure on Microcontact Printing Process

梅德庆,戴宇,汪延成,梁观浩

DOI: https://doi.org/10.3969/j.issn.1672-6030.2013.05.013

2013-01-01

Nanotechnology and Precision Engineering

Abstract:Microcontact printing( μCP) is a highly efficient and low-cost technology for surface patterning in micro / nano scale. The effects of stamp mechanical properties and printing pressures on the quality of fabricated micropatterns during μCP process were investigated. To study the polydimethylsiloxane( PDMS) based stamps,five mass ratios of PDMS specimens were fabricated,then their uniaxial tension and compression testing experiments were conducted,and the relationship between stress and stain was gained. Three line-pattern stamps with different mass ratios were cast when the printing pressure was applied within the range from 1 kPa to 1 MPa. The printing quality was assessed by graphic analysis. Experimental results demonstrate that the optimal pressure is within the range from 20 kPa to 200 kPa. Lower pressure causes larger defects due to the confined space for patterning,while larger pressure leads to the deformation of stamps. The results also show that the stamp of 20∶ 1 mass ratio can obtain the highest quality of the printed patterns under medium level pressure due to its lowest Young's modulus. Hard stamp can be effective in resisting some deformations during printing.
Study on Influence of Adhesion Properties in Screen Printing Electronic Ink Transfer

Ye Tian,YingCai Yuan,Lin Zhao,GaoSheng He,TuoKai Peng,Jianlin Xu,LiJie Cao,TianQi Gu,Yan Li

DOI: https://doi.org/10.1155/2022/2229688

IF: 1.616

2022-04-21

Shock and Vibration

Abstract:Printing electronic components by screen printing with the excellent printing quality, high efficiency, and environmental protection has broad application prospects in additive manufacturing. However, because conductive-ink blocks the screen, printing efficiency and quality decreased in the printing process. Thus, it is pivotal to explore adhesion factors from the interaction of conductive ink and screen. Herein, according to the transfer process of screen printing ink, solid-liquid wetting theory, and adhesion mechanism, we establish a liquid bridge adhesion model between two plates and obtain the functional relationship between the adhesion force and its influencing factors. Fluent software verifies the adhesion force model's conclusion to get the influence trend of the adhesion force on the ink residue. At last, by establishing a liquid bridge tensile fracture test, we gain experimental results consistent with the theoretical model and numerical simulation results. It is demonstrated that solid-liquid contact angle, tensile distance, and liquid volume are the main factors affecting the change of solid-liquid adhesion. The increase of tensile distance and contact angle will affect the adhesion force. The smaller the maximum solid-liquid adhesion during the initial stretching of the liquid bridge, the less the residual amount remained on the solid surface. By means of screen modification, the adhesion between conductive ink and screen can be reduced; meanwhile, the efficiency and quality of printed products can be improved. What's more, it also provides a valuable reference for the modification of screen printing electronics.

engineering, mechanical,mechanics,acoustics
Mechanics of Active Elastomeric Surfaces with Tunable Adhesion for Non-Contact Pick-Up and Printing

Xiaofei Zhang,Changhong Linghu,Hongyu Luo,Jizhou Song

DOI: https://doi.org/10.1016/j.ijsolstr.2021.02.024

IF: 3.667

2021-01-01

International Journal of Solids and Structures

Abstract:Transfer printing is an emerging technique for deterministic assembly and integration of multiscale and classes of materials on desired substrates with great potential in developing advanced electronic systems. Theoretical mechanics models are developed for an active elastomeric adhesive with the focus on the unusual capabilities of non-contact pick-up and printing. The active adhesive features cavities embedded under its contacting surface and encapsulated by a thin elastomeric surface membrane. Theoretical predictions on the pull-off force for pick-up and critical condition for non-contact printing agree well with experiments. Influences of geometrical parameters and material properties on the interfacial adhesion are systematically studied. These results may serve as the theoretical basis for adhesive optimization and provide guidelines for non-contact transfer printing, which is essential in applications of stretchable electronics and micro-LED displays.
Transfer Printing Techniques for Flexible and Stretchable Inorganic Electronics

Linghu, Changhong,Zhang, Shun,Wang, Chengjun,Song, Jizhou

DOI: https://doi.org/10.1038/s41528-018-0037-x

IF: 14.6

2018-01-01

npj Flexible Electronics

Abstract:Transfer printing is an emerging deterministic assembly technique for micro-fabrication and nano-fabrication, which enables the heterogeneous integration of classes of materials into desired functional layouts. It creates engineering opportunities in the area of flexible and stretchable inorganic electronics with equal performance to conventional wafer-based devices but the ability to be deformed like a rubber, where prefabricated inorganic semiconductor materials or devices on the donor wafer are required to be transfer-printed onto unconventional flexible substrates. This paper provides a brief review of recent advances on transfer printing techniques for flexible and stretchable inorganic electronics. The basic concept for each transfer printing technique is overviewed. The performances of these transfer printing techniques are summarized and compared followed by the discussions of perspectives and challenges for future developments and applications.
Electric Field-Driven Jetting and Water-Assisted Transfer Printing for High-Resolution Electronics on Complex Curved Surfaces

Wenzheng Sun,Zhenghao Li,Xiaoyang Zhu,Houchao Zhang,Hongke Li,Rui Wang,Wensong Ge,Huangyu Chen,Xinyi Du,Chaohong Liu,Fan Zhang,Fei Wang,Guangming Zhang,Hongbo Lan

DOI: https://doi.org/10.3390/electronics13071182

IF: 2.9

2024-03-24

Electronics

Abstract:High-resolution electronics on complex curved surfaces have wide applications in fields such as biometric health monitoring, intelligent aircraft skins, conformal displays, and biomimetics. However, current manufacturing processes can only adapt to limited curvature, posing a significant challenge for achieving high-resolution fabrication of electronics on complex curved surfaces. In this study, we propose a novel fabrication strategy that combines electric field-driven jetting and water-assisted transfer printing techniques to achieve the fabrication of high-resolution electronics on complex curved surfaces. The electric field-driven jetting enables the fabrication of high-resolution 2D electronics on sacrificial layer substrates. After dissolving the sacrificial layer, it is observed that the 2D electronics form a self-supporting structure with a certain rigidity and flexibility. During the water-assisted transfer printing process, this self-supporting structure undergoes stretching deformation with excellent conformity of the electronics to curved surfaces while effectively minimizing wrinkles. Finally, we successfully demonstrate the manufacture of 25 μm high-resolution electronics on highly curved surfaces (nautilus shell) and complex (scallop shell, stone) surfaces. The integrity of transferred circuit patterns and consistency of conductors are verified through infrared thermography analysis, confirming the feasibility of this manufacturing strategy. In addition, a protective film with strong adhesive properties is sprayed onto the transferred curved circuits to enhance their adhesion and resistance to extreme environments such as acids and alkalis. Our proposed technique provides a simple and effective new strategy for the fabrication of high-resolution electronics on complex curved surfaces.

engineering, electrical & electronic,computer science, information systems,physics, applied
An Accurate Thermomechanical Model for Laser-Driven Microtransfer Printing

Yuyan Gao,Yuhang Li,Rui Li,Jizhou Song

DOI: https://doi.org/10.1115/1.4036257

2017-01-01

Journal of Applied Mechanics

Abstract:A recently developed transfer printing technique, laser-driven noncontact microtransfer printing, which involves laser-induced heating to initiate the separation at the interface between the elastomeric stamp (e.g., polydimethylsiloxane (PDMS)) and hard micro/nanomaterials (e.g., Si chip), is valuable to develop advanced engineering systems such as stretchable and curvilinear electronics. The previous thermomechanical model has identified the delamination mechanism successfully. However, that model is not valid for small-size Si chip because the size effect is ignored for simplification in the derivation of the crack tip energy release rate. This paper establishes an accurate interfacial fracture mechanics model accounting for the size effect of the Si chip. The analytical predictions agree well with finite element analysis. This accurate model may serve as the theoretical basis for system optimization, especially for determining the optimal condition in the laser-driven noncontact microtransfer printing.
Three-Dimensional Coprinting Of Liquid Metals For Directly Fabricating Stretchable Electronics

Yong He,Luyu Zhou,Junfu Zhan,Qing Gao,Jianzhong Fu,Chaoqi Xie,Haiming Zhao,Yu Liu

DOI: https://doi.org/10.1089/3dp.2017.0147

IF: 5.355

2018-01-01

3D Printing and Additive Manufacturing

Abstract:It is a significant challenge to fabricate functional stretchable electronics by directly printing Ga-based liquid metals (GLMs) due to their high surface tension. In this study, a coprinting method is developed, in which GLMs are printed together with elastic materials to overcome their poor printability. The continuous contact and extrusion of the external highly viscous elastic materials with its internal liquid metal inhibits the balling of liquid metal, achieving the liquid metal three-dimensional (3D) printing successfully. A multifunctional stretchable inductance sensor was 3D printed at the first time. This sensor can be used to test axial stretch, deflection, and radial stretch, allowing tracking of the status of soft snake structures such as the end executor of endoscope and fingers.
Ink formulation, scalable applications and challenging perspectives of screen printing for emerging printed microelectronics

Ying Zhang,Yuanyuan Zhu,Shuanghao Zheng,Liangzhu Zhang,Xiaoyu Shi,Jian He,Xiujian Chou,Zhong-Shuai Wu

DOI: https://doi.org/10.1016/j.jechem.2021.08.011

IF: 13.1

2021-12-01

Journal of Energy Chemistry

Abstract:Screen printing is regarded as a highly competitive manufacture technology for scalable and fast fabrication of printed microelectronics, owing to its advanced merits of low-cost, facile operability and scalability. However, its large-scale application in printed microelectronics is still limited by screen printing functional ink. In this review, we summarize the recent advances of ink formation, typical scalable applications, and challenging perspectives of screen printing for emerging printed microelectronics. Firstly, we introduce the major mechanism of screen printing and the formation of different organic- and aqueous-based inks by various solvents and binders. Next, we review the most widely used applications of screen printing technique in micro-batteries, micro-supercapacitors and micro-sensors, demonstrative of wide applicability. Finally, the perspectives and future challenges in the sight of screen printing are briefly discussed.

chemistry, physical,engineering, chemical, applied,energy & fuels
Effect of Lateral Dimension on the Surface Wrinkling of a Thin Film on Compliant Substrate Induced by Differential Growth/swelling

Yan Zhao,Xue Han,Guoyang Li,Conghua Lu,Yanping Cao,Xi-Qiao Feng,Huajian Gao

DOI: https://doi.org/10.1016/j.jmps.2015.06.003

IF: 5.582

2015-01-01

Journal of the Mechanics and Physics of Solids

Abstract:Surface wrinkling in thin films on compliant substrates is of considerable interest for applications involving surface patterning, smart adhesion, liquid/cell shaping, particle assembly, design of flexible electronic devices, as well as mechanical characterization of thin film systems. When the in-plane size of the system is infinite, the critical wrinkling strain is known to be governed by the moduli ratio between the film and substrate. Here we show a surprising result that the lateral dimension of the film can play a critical role in the occurrence of surface wrinkling. The basic phenomenon was established through selective UV/Ozone (UVO) exposure of a strain-free PDMS slab via composite copper grids with different meshes, followed by treatment using mixed ethanol/glycerol solvents with different volume fractions of ethanol. To understand the physics behind the experimental observations, finite element (FE) simulations were performed to establish an analytical expression for the distribution of shear tractions at the film–substrate interface. Subsequent theoretical analysis leads to closed-form predictions for the critical growth/swelling strain for the onset of wrinkling. Our analysis reveals that the occurrence of surface wrinkling and post-wrinkling pattern evolution can be controlled by tuning the lateral size of the thin film for a given moduli ratio. These results may find broad applications in preventing surface wrinkling, creating desired surface patterns, evaluating the interfacial shear strength of a film/substrate system and designing flexible electronic devices.
Recent Development of Electronic Packaging Technology

Fu Yuepeng,Tan Kai,Tian Minbo

DOI: https://doi.org/10.3969/j.issn.1003-353X.2009.02.003

2009-01-01

Abstract:The current IC line width characteristics is near sub-0.1 nm scale,according to the quantum effect,it will be the ultimate size of the semiconductor integration.The miniaturization process of electronic products will depend on the packaging technology.The current 3D SiP packaging technology,resin-core bump COG package on LCD panels,and low-temperature soldering are summarized.It also focuses on the 3D package-stack FFCSP packaging technology.The trend in development of electronic packaging technology is also pointed out,it reveals that the emergency of these technologies is the foundation for finer electronic packaging coming into reality.
Pressured liquid metal screen printing for rapid manufacture of high resolution electronic patterns

lei wang,jing liu

DOI: https://doi.org/10.1039/c5ra10295b

IF: 4.036

2015-01-01

RSC Advances

Abstract:In this paper, a pressured liquid metal screen printing method for rapidly manufacturing electronically conductive patterns is proposed and experimentally demonstrated. The atomized liquid metal microdroplets are pushed through the mesh openings to wet the target substrate under the airflow force. As the screen is removed away from the substrate, a liquid metal pattern is formed. The width and the thickness of the printed track can reach small values of 233.7 mu m and 94.5 mu m, respectively, with the surface root mean square roughness of the printed plane at 1.27 mu m. With such a printing method, various kinds of complex electronic patterns such as functional circuits, general art drawings etc. can be fabricated in a short time on flexible or rigid substrates with different surface roughnesses. Durability and bending tests are performed to investigate the reliability and mechanical stability of the printed line resistors. In order to illustrate the screen printing of functional electronics, a liquid metal radio frequency identification antenna tag is fabricated with the reflection coefficient measured. Future applications of the liquid metal screen printing technique can be envisaged in flexible printed circuit board manufacturing, paper-based electronics, metal tags, the art of metal calligraphy & painting and so on.
Screen Printing Fine Pitch Stretchable Silver Inks onto a Flexible Substrate for Wearable Applications

Jianbiao Pan,Malcolm Keif,Joshua Ledgerwood,Xiaoying Rong,Xuan Wang

DOI: https://doi.org/10.4071/2380-4505-2018.1.000665

2018-10-01

International Symposium on Microelectronics

Abstract:Abstract The lightweight and bendable features of printed flexible electronics are increasingly attractive. Currently stretchable silver inks are formulated for wide traces, typically larger than 2 mm. To attach ultra-thin silicon chips that have fine pitch onto printed organic substrate, it is necessary to print fine trace width/space that matches the pitch of the chips, which may be less than 200 microns. This paper presents the development and optimization of the screen printing process for printing stretchable silver ink onto stretchable thermoplastic polyurethane (TPU) substrate. A test vehicle was designed including 50 μm/5 mm (line width/line length) to 350 μm/35 mm lines (at 4 biases). The stretchable ink selected was DuPont PE 873 and Dupont's PE 5025 ink (non-stretchable conductive flake silver) was used as a “control” to baseline the printing process. The substrate used was Bemis TPU ST604. The experiment was done on a DEK Horizon 03i printer. A DEK squeegee 200 (Blue) and a DEK 265 flood bar (200 mm) were used. A 2-level factorial design with three replicates was selected to investigate the effect of process parameters on the quality of prints. The quality of the prints is characterized by 1) resistance of traces, 2) sheet resistance, 3) z-axis height, and 4) trace width/spacing. We observed significant noise in the z-axis printed silver ink height measured by profilometry and concluded z-axis height is not a good response variable for characterizing screen printing stretchable silver ink onto TPU substrate, mainly due to high roughness of the TPU substrate. We proposed calculated sheet resistance based on the measured resistance value, trace width, and trace length, which can replace trace height measurements on rough profile substrates. We found that squeegee pressure and emulsion thickness have statistically significant effects on calculated sheet resistance of print traces while print speed does not have statistically significant effects. In our experiment setting levels, the lower the squeegee pressure, the lower the calculated sheet resistance that is achieved. The emulsion with higher emulsion over mesh (EOM) is better than the emulsion with lower EOM since it can achieve lower sheet resistance. After optimizing the screen printing process, we were able to print 100 μm (4 mils) trace width and spacing with high consistency.

Surface Tension and Screen Printing Precision

Dynamics of Liquid Transfer from Nanoporous Stamps in High-Resolution Flexographic Printing

High Resolution Direct Writing Liquid Metal Patterns for Printed Stretchable Electronics

Effect Of Surface Energies On Screen Printing Resolution

Research on Surface Modification of Screen Printing Electronics

Recent Advances on Mechanics of Transfer Printing for Flexible and Stretchable Electronics

Surface effects on the wrinkles in a stiff thin film bonded to a compliant substrate

Multi-step exposure method for improving structure flatness in digital light processing-based printing

Interfacial Liquid Film Transfer Printing of Versatile Flexible Electronic Devices with High Yield Ratio

Effects of Stamp Properties and Printing Pressure on Microcontact Printing Process

Study on Influence of Adhesion Properties in Screen Printing Electronic Ink Transfer

Mechanics of Active Elastomeric Surfaces with Tunable Adhesion for Non-Contact Pick-Up and Printing

Transfer Printing Techniques for Flexible and Stretchable Inorganic Electronics

Electric Field-Driven Jetting and Water-Assisted Transfer Printing for High-Resolution Electronics on Complex Curved Surfaces

An Accurate Thermomechanical Model for Laser-Driven Microtransfer Printing

Three-Dimensional Coprinting Of Liquid Metals For Directly Fabricating Stretchable Electronics

Ink formulation, scalable applications and challenging perspectives of screen printing for emerging printed microelectronics

Effect of Lateral Dimension on the Surface Wrinkling of a Thin Film on Compliant Substrate Induced by Differential Growth/swelling

Recent Development of Electronic Packaging Technology

Pressured liquid metal screen printing for rapid manufacture of high resolution electronic patterns

Screen Printing Fine Pitch Stretchable Silver Inks onto a Flexible Substrate for Wearable Applications