Abstract:The patterning of semiconductors with complex 3D hierarchical structures having sub-100 nm resolution is propelling a new generation of optical metasurfaces for applications in optoelectronic interconnects and hyperspectral imaging. These complex structures are now manufacturable with the advent of Metal-assisted chemical imprinting (Mac-Imprint). This technique involves bringing a 3D patterned catalytic stamp into contact with a semiconductor substrate in the presence of an etching solution. Recently, a novel class of catalytic stamps made of Au-coated porous polymeric membranes was developed in order to allow for etching solution storage and mass-transport of the reactants, all of which are essential for fast and accurate Mac-Imprint. Further, the flexibility and stretchability of these porous membranes allows for the use of pressure-based actuation to bring both planar and non-planar substrates in conformal contact with the stamp, replicating the set-up of modern nanoimprinting lithography equipment. Due to the contact-based nature of the Mac-Imprint process, it is vital to understand the mechanical behavior of the stamp. Thus, this work attempts to computationally elucidate the mechanical behavior of the stamp during conformal Mac- Imprint. In particular, the elastic behavior of a stamps laminate made of commercial porous polyvinylidene fluoride (PVDF) with nominal pore sizes of 100 nm and solid polyimide (PI) is modelled using finite element analysis (FEA) in a commercial ANSYS software with material constants, extracted via uniaxial tensile test. The FEA prediction using 2D axisymmetric model is able to capture the induced biaxial stress, strain, deflection and yield of the porous PVDF. To validate simulation results, a deflection test was experimentally performed as a function of air pressure and the obtained results matched with the FEA simulation.

Effects of Stamp Properties and Printing Pressure on Microcontact Printing Process

Dynamics of Liquid Transfer from Nanoporous Stamps in High-Resolution Flexographic Printing

Optimization of Control Parameters in Micro Hot Embossing

Mechanics of pressure driven transfer printing for stamp with micropillars

Low Cost and Lithography-free Stamp fabrication for Microcontact Printing

Mechanics of transfer printing for elastomeric stamps with collapse cavities

Microcontact printing of dendrimers, proteins, and nanoparticles by porous stamps.

Understanding mechanical response of porous polymeric stamps during large-area metal-assisted chemical imprinting of silicon

Topographically Flat, Chemically Patterned PDMS Stamps Made by Dip‐Pen Nanolithography

Simulation Research on Stress of Polymeric Patterns During Micro Hot Embossing

Solid-Phase Microcontact Printing for Precise Patterning of Rough Surfaces: Using Polymer-Tethered Elastomeric Stamps for the Transfer of Reactive Silanes

Scanner‐Based Capillary Stamping

Flow Behavior of Polymer During Micro Hot Embossing

Contact Radius of Stamps in Reversible Adhesion

Analysis of Pattern Height Development in Hot Embossing Process

Microcontact Printing: A New Technology on Micro-fabrication and Nano-fabrication

Microfabrication using elastomeric stamp deformation

An Accurate Thermomechanical Model for Laser-Driven Microtransfer Printing

Capillary Nanostamping with Spongy Mesoporous Silica Stamps

Defects in Micro Hot Embossing Process

Directionally Controlled Transfer Printing Using Micropatterned Stamps