High-reliability epoxy molding compound for surface mounting technology

Shanjun Li,Xiaolin Tang
1996-01-01
Abstract:A survey was made on the recent development in the new kind of epoxy molding compounds for surface mounting technology to meet the increasingly strict demands from the IC manufacturers, with emphasis put on two aspects: (1) using the biphenyl epoxy resin, which has very-low melt viscosity and high filler loading capacity, to replace the conventional ortho-cresol-novolac epoxy resin; (2) using an aromatic and alicyclic structure instead of methyl chain in the frame of conventional phenol novolac. By taking these two measures, materials thus developed show a significant improvement in the resistance against the solder cracks and in PCT as compared with the conventional molding compounds in the surface mounting packages.
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