Synthesis and properties of novel controlled thermally degradable epoxy resin for electronic packaging

Ling-jie TONG,Peng WANG,Fei XIAO

DOI: https://doi.org/10.3969/j.issn.1007-4252.2006.02.016

2006-01-01

Abstract:The synthesis, formulation and characterizations of two new diepoxides, were reported, one. diepoxide contains tertiary ester (EP-1) and the other contains tertiary ether linkages (EP-2). Both compounds were characterized with 1H-NMR and FT-IR and formulated into underfill materials with an anhydride as hardener and a 2-methylimidazole as catalyst. A dual-epoxy system (EP-3) was also formulated with the tertiary ester diepoxide and a conventional aliphatic diepoxide, ERL-4221, using the same hardener and catalyst. The thermogravimetric analysis (TGA) reveals that the cured EP-2 and EP-3 had obviously lower thermal decomposition onset temperature (around 215°C) than ERL-4221 (310°C)). The shear strength and glass transition temperatures of these novel diepoxides decrease quickly upon being aged at 225°C. The unusual thermal degradable properties make these compounds a potential use as reworkable underfill for flip-chip application.