Microstructure evolution and reaction behavior of Cu–Ni–Si powder system under solid-state sintering
Lei Jia,Ming-fang Yang,Shi-ping Tao,Hui Xie,Zhen-lin Lu,Katsuyoshi Kondoh,Zhi-guo Xing
DOI: https://doi.org/10.1016/j.matchemphys.2021.124942
IF: 4.778
2021-10-01
Materials Chemistry and Physics
Abstract:<p>Cu–Ni–Si powder compacts were firstly prepared by mechanical mixing and cold-pressing, and then held at 600, 700, 800, 900, 950 and 1000 °C for 5 min followed by water-quenching. Subsequently, X-ray diffraction (XRD), scanning electron microscope (SEM), energy dispersive spectrometer (EDS) and transmission electron microscope (TEM) were used to characterize the microstructure and phase composition of water-quenched samples, and competitive reactions among Ni–Si compounds were also discussed. Finally, a schematic diagram about the solid-state reaction process of Cu–Ni–Si powder system was proposed. Results showed that Ni and Si substances started to diffuse and reacted when the temperature was above 600 °C, resulting in the formations of Ni<sub>31</sub>Si<sub>12</sub> phase at the primary powder boundary and Ni<sub>2</sub>Si precipitations inside the Cu powder, respectively. With the increase of temperature, Ni<sub>2</sub>Si phase dissolved into Cu matrix while the amount and size of Ni<sub>31</sub>Si<sub>12</sub> phase increased along with the morphology changing from chrysanthemum-like shape to equiaxed structure. The final microstructure of Cu–Ni–Si powder system after sintering and water quenching consisted of Cu(Ni,Si) solid solution and equiaxed Ni<sub>31</sub>Si<sub>12</sub> phase at the primary powder boundary, which was expected to achieve a combination of high strength and high electrical conductivity by subsequent heat treatments.</p>
materials science, multidisciplinary